Method and apparatus for cleaning the edge of a thin disc

• US 20010002593A1
• Filed: 12/15/2000
• Published: 06/07/2001
• Est. Priority Date: 11/11/1998
• Status: Active Grant

• Current Assignee: Boris Fishkin, Brian J. Brown, Jianshe Tang
• Original Assignee: Boris Fishkin, Brian J. Brown, Jianshe Tang
• Inventors: Brown, Brian J., Tang, Jianshe, Fishkin, Boris
• Granted Patent: US 6,345,630 B2
• Time in Patent Office: Days
• US Class Current: 134/1.3
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc'"'"'s edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH₄OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

Claims

1. A method adapted to clean an edge of a thin disc comprising:

providing a thin disc having an edge and a first major surface;

providing a first sonic nozzle that produces a jet of sonicated liquid;

positioning the first sonic nozzle so that the first sonic nozzle is radially spaced from the edge of the thin disk, and so that the jet of sonicated liquid strikes the edge of the thin disc at an angle approximately between 30° and

150°

from a tangent to the edge of the thin disc and approximately between 135° and

225°

from the first major surface of the thin disc; and

scanning the thin disc edge relative to the first sonic nozzle while maintaining the positioning of the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc, thereby cleaning the edge of the thin disc with the jet of sonicated liquid from the first sonic nozzle.

2. The method of

claim 1

wherein providing a thin disc having an edge and a first major surface comprises providing a semiconductor wafer having an edge and a first major surface.

3. The method of

claim 1

wherein providing a first sonic nozzle that produces a jet of sonicated liquid comprises providing a first megasonic nozzle that produces a jet of sonicated liquid.

4. The method of

claim 1

wherein providing a first sonic nozzle that produces a jet of sonicated liquid comprises providing a first sonic nozzle that produces a jet of sonicated liquid selected from the group consisting of de-ionized water, NH₄OH, KOH, TMAH, HF, citric acid and a surfactant.

5. The method of

claim 1

wherein positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc comprises positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc at an angle approximately between 45°

and 135°

from a tangent to the edge of the thin disc and approximately between 150° and

210°

from the first major surface of the thin disc.

6. The method of

claim 5

wherein positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc comprises positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc at an angle approximately between 45°

and 135°

from a tangent to the edge of the thin disc and approximately between 170° and

190°

from the first major surface of the thin disc.

7. The method of

claim 6

wherein positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc comprises positioning the first sonic nozzle so that the jet of sonicated liquid strikes the thin disc at an angle of approximately 45°

from a tangent to the edge of the thin disc and approximately 180°

from the first major surface of the thin disc.

8. The method of

claim 1

wherein positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc comprises positioning the first sonic nozzle a radial distance of approximately 1 mm to 50 mm from the edge of the thin disc.

9. The method of

claim 8

wherein positioning the first sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc comprises positioning the first sonic nozzle a radial distance of approximately 7 mm to 20 mm from the edge of the thin disc.

10. The method of

claim 1

wherein scanning the thin disc edge relative to the first sonic nozzle comprises rotating the thin disc.

11. The method of

claim 1

further comprising cleaning the first major surface of the thin disc via brush scrubbing while cleaning the edge of the thin disc.

12. The method of

claim 1

further comprising cleaning the first major surface of the thin disc via a major surface cleaning mechanism while cleaning the edge of the thin disc.

13. The method of

claim 11

wherein cleaning the first major surface of the thin disc via brush scrubbing while cleaning the edge of the thin disc comprises cleaning the first major surface and a second major surface of the thin disc via brush scrubbing while cleaning the edge of the thin disc.

14. The method of

claim 12

wherein cleaning the first major surface of the thin disc via a major surface cleaning mechanism while cleaning the edge of the thin disc comprises cleaning the first major surface and a second major surface of the thin disc via a major surface cleaning mechanism while cleaning the edge of the thin disc.

15. The method of

claim 1

further comprising:

providing a second sonic nozzle that produces a jet of sonicated liquid; and

positioning the second sonic nozzle so that the second sonic nozzle is radially spaced from the edge of the thin disk, and so that the jet of sonicated liquid strikes the edge of the thin disc at an angle approximately between 30° and

150°

from a tangent to the edge of the thin disc and approximately between 135° and

225°

from the first major surface of the thin disc.

16. A method adapted to clean an edge of a thin disc comprising:

providing a thin disc having an edge and a major surface;

providing a sonic nozzle that produces a jet of sonicated liquid;

positioning the sonic nozzle so that the sonic nozzle is radially spaced from the edge of the thin disk, and so that the jet of sonicated liquid strikes the edge of the thin disc at an angle approximately between 30° and

150°

from a tangent to the edge of the thin disc and approximately between 135° and

225°

from the major surface of the thin disc;

scanning the thin disc edge relative to the sonic nozzle while maintaining the positioning of the sonic nozzle so that the jet of sonicated liquid strikes the edge of the thin disc, thereby cleaning the edge of the thin disc with the jet of sonicated liquid from the sonic nozzle;

providing a cleaning mechanism; and

cleaning the major surface of the thin disc via the cleaning mechanism.