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Flip chip with integrated flux and underfill

  • US 20010003058A1
  • Filed: 12/06/2000
  • Published: 06/07/2001
  • Est. Priority Date: 03/10/1999
  • Status: Abandoned Application
First Claim
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1. An integrated circuit assembly which comprises:

  • a) a substrate having a plurality of solderable contact sites on a surface thereof;

    b) a plurality of solder bumps positioned on the substrate such that each of the solderable contact sites has one solder bump associated therewith, the solder bumps being affixed to the solderable contact sites; and

    c) an underfill material applied to the surface of the substrate, the underfill material at least occupying a space defined between each of the solder bumps and characterized in that, upon heating to a solder reflow temperature, at least a portion of the underfill material acts as a solder flux.

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