Die bonding method and apparatus

• US 20010004002A1
• Filed: 12/15/2000
• Published: 06/21/2001
• Est. Priority Date: 12/15/1999
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Shinkawa
• Original Assignee: Kabushiki Kaisha Shinkawa
• Inventors: Kikuchi, Eiji, Yonemoto, Michio, Arai, Tsuneharu
• Granted Patent: US 6,547,902 B2
• Time in Patent Office: Days
• US Class Current: 156/249
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: Y10S 156/942 with reorientation means
• CPC Class Codes: Y10T 156/1978 Delaminating bending means

Abstract

In die bonding in which good dies are bonded to good bonding portions of a bonding object (substrates, tapes, etc) and bad dies are bonded to bad bonding portions of the bonding object, dies on a wafer are successively detected and discriminated by a die detecting camera, dies are classified into good dies and bad dies on the basis of the results of this detection and discrimination, dies are registered on a wafer good/bad status map, and dies registered on the wafer good/bad status map are picked up by a die-transporting nozzle, transferred and bonded according to whether good dies or bad dies are requested based upon detection of bonding portions of the bonding object.

Claims

1. A die bonding method in which good dies are bonded to good bonding portions on a bonding object and bad dies are bonded to bad bonding portions on said bonding object, said method comprising the steps of:

successively detecting dies on a wafer by a detection means,

classifying said dies into good dies and bad dies based upon results of said successive detection,

registering said dies on a wafer good/bad status map, and

picking up, transferring and bonding said dies to said bonding portions in response to a request for either good dies or bad dies depending upon a result of detection of said bonding portions.

2. A die bonding method in which good dies are bonded to good bonding portions on a bonding object and bad dies are bonded to bad bonding portions on said bonding object, said method comprising the steps of:

successively detecting dies on a wafer by a detection means,

classifying said dies into good dies and bad dies based upon results of said successive detection,

registering said dies on a wafer good/bad status map,

picking up, transferring and bonding said dies to said bonding portions in response to a request for either good dies or bad dies depending upon a result of detection of said bonding portions, and

in a case where there are no bad dies registered on said wafer good/bad status map, picking up and transferring bad dies inside a tray which accommodates therein bad dies and is provided in addition to said wafer, and bonding said bad dies to said bonding portions.

3. A die bonding apparatus in which good dies are bonded to good bonding portions on a bonding object and bad dies are bonded to bad bonding portions on said bonding object, wherein dies are classified into good dies and bad dies based upon results of successive detection and discrimination of said dies on a wafer by a detection means, said dies are registered on a wafer good/bad status map, and said dies registered on said wafer good/bad status map are picked up, transferred and bonded to said bonding portions in response to a request for either good dies or bad dies depending upon a result of detection of said bonding portions.

4. A die bonding apparatus which good dies are bonded to good bonding portions on a bonding object and bad dies are bonded to bad bonding portions on said bonding object, wherein a tray which accommodates therein bad dies is provided in addition to a wafer;

and wherein dies are classified into good dies and bad dies on based upon results of successive detection and discrimination of said dies on said wafer by a detection means, said dies are registered on a wafer good/bad status map, said dies registered on said wafer good/bad status map are picked up, transferred and bonded to said bonding portions in response to a request for either good dies or bad dies depending upon a result of detection of said bonding portions, and in a case where there are no bad dies registered on said wafer good/bad status map, bad dies inside said tray are picked up, transferred and bonded to said bonding portions.

5. A die bonding apparatus in which good dies are bonded to good bonding portions on a bonding object and bad dies are bonded to bad bonding portions on said bonding object, said bonding apparatus comprising:

a wafer ring holding device which positions and holds a wafer;

a die transferring nozzle which picks up, holds and transfers dies from said wafer;

a die detecting camera which detects positions and good/bad status of said dies on said wafer;

a tray which accommodates bad dies;

a bad die chucking nozzle which picks up, holds and transfers bad dies from said tray;

a bonding object conveying device which conveys said bonding object;

a bonding device which bonds dies to said bonding portions of said bonding object; and

a bonding portion detecting camera which detects a good/bad status of said bonding portions of said bonding object;

wherein

when good dies are to be bonded to good bonding portions on said bonding object, good dies from said wafer are picked up, transferred and bonded to said good bonding portions; and

when bad dies are to be bonded to bad bonding portions on said bonding object,

bad dies from said wafer are picked up, transferred and bonded to said bad bonding portions in cases where bad dies that have been detected on said wafer and registered are available, and

bad dies from said tray are picked up, transferred and bonded to said bad bonding portions in cases where no registered bad dies are available on said wafer.