Method for manufacturing thin film transistor liquid crystal display
First Claim
1. A method for manufacturing thin film transistor liquid crystal display including a pixel electrode and a counter electrode which are so formed on a back substrate that a driving electric field is generated in a liquid crystal cell, thin film transistor which has gate electrode, source electrode, and drain electrode and which apply prescribed picture signal between the pixel electrode and the counter electrode, and a storage capacitor electrode connected to the counter electrode, includes the steps of:
- forming a metal layer for gate electrode on the back substrate;
patterning the metal layer for gate electrode through a first photolithograph process so that the gate electrode and the storage capacitor electrode may be formed;
forming sequentially gate insulation layer, amorphous silicon layer for channel and doped semiconductor layer for ohmic contact, and metal layer for source/drain electrode on the back substrate where the gate electrode and the storage capacitor electrode have been formed;
patterning the metal layer for source/drain electrode and the doped semiconductor layer for ohmic contact through a second photolithograph process so that the source electrode, the drain electrode, and the ohmic contacts thereof may be formed;
forming a passivation layer on the back substrate where the source electrode and the drain electrode have been formed;
patterning the passivation layer, the amorphous silicon layer for channel, and the gate insulation layer through a third photolithograph process so that a part of the drain electrode and the back substrate portion between the storage capacitor electrode and the thin film transistor may be exposed;
forming a transparent conductive layer for pixel electrode so as to contact with the exposed portions of the drain electrode and the back substrate;
patterning the transparent conductive layer for pixel electrode through a fourth photolithograph process so that a pixel electrode may be formed to contact with the exposed portion of drain electrode.
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Accused Products
Abstract
The present invention discloses a method for manufacturing thin film transistor liquid crystal display including the following steps so as to form simultaneously a via hole for contacting a drain electrode and a pixel electrode mutually and the channel of thin film transistor:
forming sequentially gate insulation layer, amorphous silicon layer for channel and doped semiconductor layer for ohmic contact, and metal layer for source/drain electrode on the back substrate where the gate electrode and the storage capacitor electrode have been formed; patterning the metal layer for source/drain electrode and the doped semiconductor layer for ohmic contact through a second photolithograph process so that the source electrode, the drain electrode, and the ohmic contacts thereof may be formed; forming a passivation layer on the back substrate where the source electrode and the drain electrode have been formed; patterning the passivation layer, the amorphous silicon layer for channel, and the gate insulation layer through a third photolithograph process so that a part of the drain electrode and the back substrate portion between the storage capacitor electrode and the thin film transistor may be exposed.
11 Citations
2 Claims
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1. A method for manufacturing thin film transistor liquid crystal display including a pixel electrode and a counter electrode which are so formed on a back substrate that a driving electric field is generated in a liquid crystal cell, thin film transistor which has gate electrode, source electrode, and drain electrode and which apply prescribed picture signal between the pixel electrode and the counter electrode, and a storage capacitor electrode connected to the counter electrode, includes the steps of:
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forming a metal layer for gate electrode on the back substrate;
patterning the metal layer for gate electrode through a first photolithograph process so that the gate electrode and the storage capacitor electrode may be formed;
forming sequentially gate insulation layer, amorphous silicon layer for channel and doped semiconductor layer for ohmic contact, and metal layer for source/drain electrode on the back substrate where the gate electrode and the storage capacitor electrode have been formed;
patterning the metal layer for source/drain electrode and the doped semiconductor layer for ohmic contact through a second photolithograph process so that the source electrode, the drain electrode, and the ohmic contacts thereof may be formed;
forming a passivation layer on the back substrate where the source electrode and the drain electrode have been formed;
patterning the passivation layer, the amorphous silicon layer for channel, and the gate insulation layer through a third photolithograph process so that a part of the drain electrode and the back substrate portion between the storage capacitor electrode and the thin film transistor may be exposed;
forming a transparent conductive layer for pixel electrode so as to contact with the exposed portions of the drain electrode and the back substrate;
patterning the transparent conductive layer for pixel electrode through a fourth photolithograph process so that a pixel electrode may be formed to contact with the exposed portion of drain electrode. - View Dependent Claims (2)
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Specification