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Slurry for chemical mechanical polishing

  • US 20010006225A1
  • Filed: 12/22/2000
  • Published: 07/05/2001
  • Est. Priority Date: 12/28/1999
  • Status: Abandoned Application
First Claim
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1. A slurry used for chemical mechanical polishing of a substrate having a copper-containing film at the surface, which slurry contains an abrasive, an oxidizing agent, and an adhesion-inhibitor preventing adhesion of a polishing product to a polishing pad.

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