Positioning mark and alignment method using the same

• US 20010008442A1
• Filed: 02/27/2001
• Published: 07/19/2001
• Est. Priority Date: 08/06/1998
• Status: Abandoned Application

• Current Assignee: Eiichi Miyake
• Original Assignee: Eiichi Miyake
• Inventors: Miyake, Eiichi
• Application Number:
  US09/793,611
• Publication Number:
  US 20010008442A1
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 9/00 Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically G03F7/22 takes precedence; preparation of photographic masks G03F1/00; within photographic printing apparatus for making copies G03B27/00
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/09927 Machine readable code, e.g. bar code
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks

Abstract

Each positioning mark comprises a plurality of mark elements. The mark elements are adapted to be individually determined for their respective positions and configurations. A reference point of the positioning mark is located on the basis of data obtained by determining respective positions and configurations of the mark elements.

Claims

1. A positioning apparatus comprising:

a substrate for a printed circuit board; and

a positioning mark formed on said substrate, said positioning mark including a plurality of substantially circular holes.

2. The apparatus of

claim 1

, wherein said plurality of substantially circular holes are arranged in a substantially circular formation.

3. The apparatus of

claim 2

, wherein said positioning mark is formed on said substrate such that a position and a configuration of each of said substantially circular holes can be individually determined;

and

a reference point of said positioning mark is located based on the individually determined positions and configurations of said substantially circular holes.

4. The apparatus of

claim 2

, wherein each of said substantially circular holes comprises a blind-hole.

5. The apparatus of

claim 2

, wherein each of said substantially circular holes comprises a through-hole.

6. The apparatus of

claim 1

, wherein each of said substantially circular holes comprises a blind-hole.

7. The apparatus of

claim 1

, wherein each of said substantially circular holes comprises a through-hole.

8. The apparatus of

claim 1

, wherein said positioning mark comprises an alignment mark, further comprising a photo-mask and a second positioning mark formed on said photo-mask, said alignment mark and said second positioning mark being used for performing a positional alignment of said substrate and said photo-mask.

9. The apparatus of

claim 1

, further comprising a plurality of positioning marks formed on said substrate, said positioning marks being spaced apart from each other on said substrate such that said positioning marks are used for determining a distance between any two of said positioning marks.

10. A method of positional alignment comprising:

forming a plurality of positioning marks at positions spaced apart from one another on a substrate for a printed circuit board, each of the positioning marks including a plurality of substantially circular holes, and the plurality of positioning marks formed on the substrate comprising a first set of alignment marks;

forming a plurality of positioning marks on a photo-mask at respective positions corresponding to the positions of the first set of alignment marks, the plurality of positioning marks formed on the photo-mask comprising a second set of alignment marks, wherein at least a portion of the photo-mask whereon the positioning marks are formed is optically transparent;

arranging the substrate and the photo-mask in a close adjacent relationship, whereat the first set of alignment marks and the second set of alignment marks overlap each other so as to form a plurality of pairs of overlapping first and second alignment marks;

determining respective positions of each alignment mark in each pair of overlapping first and second alignment marks;

obtaining an amount of misalignment between each alignment mark in each pair of overlapping first and second alignment marks based on said determining of the respective positions of each alignment mark in each pair of overlapping first and second alignment marks; and

moving one of said substrate and said photo-mask in at least one of an X-direction, a Y-direction, and a Theta-direction based on the amount of misalignment so as to align the substrate and the photo-mask.

11. The method of

claim 10

, wherein said forming of the plurality of positioning marks on the substrate for a printed circuit board comprises arranging the plurality of substantially circular holes of each of the positioning marks in a substantially circular formation;

further comprising individually determining a position and a configuration of each of the substantially circular holes of each of the positioning marks; and

determining a location of a reference point for each of the positioning marks based on the individually determined positions and configurations of the substantially circular holes.

12. The method of

claim 11

, wherein the reference point for each of the positioning marks is the center of a shape formed by the substantially circular holes of each of the positioning marks.