Polishing apparatus

• US 20010008827A1
• Filed: 01/17/2001
• Published: 07/19/2001
• Est. Priority Date: 01/17/2000
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Kimura, Norio, Shimizu, Kazuo, Osawa, Hiroyuki, Isobe, Hideji
• Granted Patent: US 6,558,229 B2
• Time in Patent Office: Days
• US Class Current: 451/8
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24B 49/10 involving electrical means B24B49/02, B24B49/08 take precedence
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Claims

1. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for holding a substrate and pressing a surface of the substrate against said polishing surface to polish said surface of the substrate; and

at least one sensor disposed below said polishing surface of said polishing table for measuring the thickness of a conductive layer formed on said surface of the substrate.

2. A polishing apparatus according to

claim 1

, wherein said sensor comprises an eddy-current sensor.

3. A polishing apparatus according to

claim 1

, wherein said sensor is mounted in said polishing table.

4. A polishing apparatus according to

claim 1

, wherein said polishing surface comprises a polishing cloth.

5. A polishing apparatus according to

claim 1

, wherein said polishing surface comprises a fixed abrasive plate.

6. A polishing apparatus according to

claim 5

, wherein said sensor is provided in said fixed abrasive plate.

7. A polishing apparatus according to

claim 2

, further comprising:

at least one optical sensor mounted in said polishing table for measuring the thickness of said conductive layer.