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Electronic component and method of production thereof

  • US 20010009342A1
  • Filed: 01/31/2001
  • Published: 07/26/2001
  • Est. Priority Date: 06/30/1995
  • Status: Active Grant
First Claim
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1. A fabricating method for fabricating an electronic device comprising the steps of:

  • (a) disposing a first surface of a printed circuit board in an opposite relation with a first surface of a functional device;

    (b) disposing a hot melt type member above the first surface of the printed circuit board and/or a second surface of the functional device, and (c) by heating/melting the hot melt type member, sealing a space portion formed between the printed circuit board and the functional device preventing the hot melt type member spreading into at least the space portion.

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