Non-contact IC module

• US 20010011012A1
• Filed: 01/26/2001
• Published: 08/02/2001
• Est. Priority Date: 01/27/2000
• Status: Active Grant

• Current Assignee: Hitachi Maxell Limited (Maxell, Ltd.)
• Original Assignee: Hitachi Maxell Limited (Maxell, Ltd.)
• Inventors: Daido, Kazuhiko, Hino, Yoshiharu
• Granted Patent: US 7,334,734 B2
• Time in Patent Office: Days
• US Class Current: 455/575.7
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.

Claims

1. An accessed object having a non-contact IC module including a semiconductor device and a radio communication antenna, wherein one of said radio communication antenna includes an IC module formed extending over two side of said accessed object.

2. An accessed object according to

claim 1

, wherein said semiconductor device and said radio communication antenna are formed on a flexible sheet and said sheet is bent and attached to said accessed object.

3. An accessed object according to

claim 2

, wherein a semiconductor device is provided in that position of said sheet which is away from the bent portion thereof.

4. An accessed object according to

claim 1

, wherein said radio communication antenna is provided in the vicinity of a corner portion of the said accessed object.

5. Accessed body according to

claim 1

, wherein said accessed object has a casing and said radio communication antenna is provided inside said casing.

6. An accessed object according to

claim 5

, wherein said casing is opaque or translucent.

7. An accessed object according to

claim 1

, wherein said accessed object is an information recording medium.

9. An accessed object according to

claim 1

, wherein an insertion recess is provided in a specified position of said accessed object and said non-contact IC module is inserted into said insertion recess.

10. An accessed object according to

claim 2

, wherein An accessed object according to

claim 2

, wherein said insertion recess is a slit.

11. An accessed object according to

claim 2

, wherein erroneous insertion preventive measure is provided both at said insertion recess and said non-contact IC module.

12. An accessed object according to

claim 1

, wherein said non-contact IC module uses a printed circuit board, said first module-side antenna is provided on one surface of said printed circuit board, said second module-side antenna is provided on the reverse surface of said printed circuit board and the first module-side antenna is continuous to the second module-side antenna via a through-hole.

13. An accessed object according to

claim 1

, wherein said non-contact IC module uses a printed circuit board, said first module-side antenna and one part of said second module-side antenna are provided on one surface of said printed circuit board, the other part of said second module-side antenna is provided on the other part of said printed circuit board, and the one part of said second module-side antenna on the one surface of said printed circuit board is continuous to the other part of said second module-side antenna on the other surface thereof.

14. An accessed object according to

claim 1

, wherein said accessed object is an information recording medium.

8. An accessed object having a non-contact IC module including a semiconductor and a module-side antenna, wherein said module-side antenna has a first module-side antenna and a second module-side antenna continuous to said first module-side antenna, wherein said first module-side antenna secures an antenna effective area by coming face-to-face relation with a first apparatus-side in a first usage mode of communication apparatus to communicate with said accessed object, and wherein said second module-side antenna is disposed close to a second apparatus-side antenna in an access direction different from the access direction of said apparatus-side antenna in a second usage mode of the communication apparatus.