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Hermetic encapsulation package and method of fabrication thereof

  • US 20010013756A1
  • Filed: 02/02/2001
  • Published: 08/16/2001
  • Est. Priority Date: 02/04/2000
  • Status: Active Grant
First Claim
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1. A hermetic encapsulation package comprising:

  • a support substrate;

    at least one element mounted on said support substrate; and

    a sealing cap bonded to said support substrate accommodating said element to form a sealed space defined by said support substrate and said sealing cap, said sealing cap deforms to vary a volume of said sealed space according to an increase or a decrease in pressure inside said sealed space.

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