Hermetic encapsulation package and method of fabrication thereof

• US 20010013756A1
• Filed: 02/02/2001
• Published: 08/16/2001
• Est. Priority Date: 02/04/2000
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: NEC Corporation
• Inventors: Mori, Kenji, Sakaguchi, Yoshikazu
• Granted Patent: US 6,611,098 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 2101/00 Properties of the organic materials covered by group H10K85/00
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

At least one organic electroluminescent (EL) element is formed on a support substrate. A sealing cap for accommodating the organic EL element is bonded to the support substrate with an ultraviolet curing resin to form a sealed space defined by the sealing cap and the support substrate. At least part of the sealing cap is formed of an elastic material of a Young'"'"'s modulus of 70 GPa or less. Furthermore, relative to the volume of the sealed space at 25° C., the sealing cap is reversibly deflected to provide a decrease of 5% or more in volume of the sealed space at −35° C. and an increase of 5% or more in volume of the sealed space at 85° C., thereby varying the volume of the sealed space to relax a change in pressure inside the sealed space caused by a change in temperature.

Claims

1. A hermetic encapsulation package comprising:

a support substrate;

at least one element mounted on said support substrate; and

a sealing cap bonded to said support substrate accommodating said element to form a sealed space defined by said support substrate and said sealing cap, said sealing cap deforms to vary a volume of said sealed space according to an increase or a decrease in pressure inside said sealed space.

2. The hermetic encapsulation package according to

claim 1

, wherein said element is an organic electroluminescent element comprising a pair of electrodes and an organic compound layer, having at least a light-emitting layer composed of an organic compound, sandwiched by said electrodes.

3. The hermetic encapsulation package according to

claim 1

, wherein a portion of said sealing cap, opposite to said support substrate, deflects according to an increase or a decrease in pressure inside said sealed space to vary the volume of said sealed space.

4. The hermetic encapsulation package according to

claim 1

, wherein said sealing cap increases and decreases the volume of said sealed space so as to relax a change in pressure caused by a change in temperature of a gas inside said sealed space in a manner such that said sealing cap is deflected outwardly relative to said sealed space with increasing temperatures to increase the volume of said sealed space and is deflected inwardly relative to said sealed space with decreasing temperatures to decrease the volume of said sealed space.

5. The hermetic encapsulation package according to

claim 1

, wherein said sealed space provides a decrease in volume of 5% or more at −

35°

C. and an increase in volume of 5% or more at 85°

C., relative to a volume at 25°

C.

6. The hermetic encapsulation package according to

claim 1

, wherein at least part of said sealing cap is formed of an elastic material of a Young'"'"'s modulus of 70 GPa or less.

7. The hermetic encapsulation package according to

claim 1

, wherein a gas barrier layer is provided on both or one of outer and inner surfaces of said sealing cap.

8. The hermetic encapsulation package according to

claim 1

, wherein said support substrate and said sealing cap are bonded to each other with an ultraviolet curing resin.

9. The hermetic encapsulation package according to

claim 1

, wherein bellows are provided on at least part of said sealing cap.

10. The hermetic encapsulation package according to

claim 2

, wherein said sealed space provides a decrease in volume of 5% or more at −

35°

C. and an increase in volume of 5% or more at 85°

C., relative to a volume at 25°

C.

11. The hermetic encapsulation package according to

claim 2

, wherein at least part of said sealing cap is formed of an elastic material of a Young'"'"'s modulus of 70 GPa or less.

12. The hermetic encapsulation package according to

claim 2

, wherein a gas barrier layer is provided on both or one of outer and inner sides of said sealing cap.

13. The hermetic encapsulation package according to

claim 2

, wherein said support substrate and said sealing cap are bonded to each other with an ultraviolet curing resin.

14. The hermetic encapsulation package according to

claim 7

, wherein said gas barrier layer has a Young'"'"'s modulus of 70 GPa or less.

15. The hermetic encapsulation package according to

claim 8

, wherein said ultraviolet curing resin is an epoxy-based resin.

16. A method for fabricating a hermetic encapsulation package comprising the steps of:

fabricating an organic panel by depositing on a support substrate by sputtering or by vapor deposition a predetermined pattern of an anode layer, an organic compound layer including at least a light-emitting layer composed of an organic compound, and a cathode layer in that order, or a predetermined pattern of a cathode layer, an organic compound layer including at least a light-emitting layer composed of an organic compound, and an anode layer in that order; and

bonding a sealing cap, at least part thereof being formed of an elastic material having a Young'"'"'s modulus of 70 GPa or less, to said support substrate in a dried atmosphere so as to accommodate a pixel-formed portion of said organic panel.

17. The method for fabricating a hermetic encapsulation package according to

claim 16

, wherein said support substrate and said sealing cap are bonded to each other with an ultraviolet curing resin.

18. The method for fabricating a hermetic encapsulation package according to

claim 16

, wherein said step of bonding further comprises the step of forming a gas barrier layer on at least one of inner and outer surfaces of said sealing cap.

19. The method for fabricating a hermetic encapsulation package according to

claim 18

, wherein said step of forming said gas barrier layer allows said gas barrier layer to be formed by vapor deposition on said sealing cap before said sealing cap and said support substrate are bonded to each other.

20. The method for fabricating a hermetic encapsulation package according to

claim 18

, wherein said step of forming said gas barrier layer allows said gas barrier layer to be formed by vapor deposition on an outside of said sealing cap after said sealing cap and said support substrate are bonded to each other.