Power inverter
First Claim
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1. A power inverter, comprising:
- at least one semiconductor module having a plurality of power inverting semiconductor elements mounted therein; and
a cooling case containing a cooling liquid for cooling said at least one semiconductor module, wherein said at least one semiconductor module comprises a semiconductor element and an electric circuit on a radiating plate, and an upper case containing said semiconductor elements and electric circuits is provided on said radiating plate, and said cooling case has a cooling channel in which the cooling liquid flows and at least one opening for bring said radiating plate in contact with the cooling liquid flowing in said cooling channel, and a first seal portion is provided at a circumference of said at least one opening, and an annular groove is formed at a circumference of said first seal portion, and at least one liquid relieving hole is formed in said annular groove, said hole leading from said groove to a surface of the cooling case other than the surface of the cooling case in contact with said radiating plate.
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Abstract
A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and leads from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inn or outside the second seal.
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Citations
9 Claims
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1. A power inverter, comprising:
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at least one semiconductor module having a plurality of power inverting semiconductor elements mounted therein; and
a cooling case containing a cooling liquid for cooling said at least one semiconductor module, wherein said at least one semiconductor module comprises a semiconductor element and an electric circuit on a radiating plate, and an upper case containing said semiconductor elements and electric circuits is provided on said radiating plate, and said cooling case has a cooling channel in which the cooling liquid flows and at least one opening for bring said radiating plate in contact with the cooling liquid flowing in said cooling channel, and a first seal portion is provided at a circumference of said at least one opening, and an annular groove is formed at a circumference of said first seal portion, and at least one liquid relieving hole is formed in said annular groove, said hole leading from said groove to a surface of the cooling case other than the surface of the cooling case in contact with said radiating plate. - View Dependent Claims (2, 3, 4, 5)
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6. A power inverter, comprising:
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at least one semiconductor module having a plurality of power inverting semiconductor elements mounted therein; and
a heat sink for cooling said at least one semiconductor module, wherein said heat sink includes a cooling channel and at least one opening in communication with said channel, and a seal portion is provided outside said at least one opening to maintain liquid tightness against a cooling liquid, and a liquid relieving gap is formed outside said seal portion and on a member forming the heat sink, said gap leading to a surface of the heat sink other than the surface of the heat sink on which said at least one semiconductor module is mounted.
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7. A power inverter, comprising:
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a circuit case accommodating at least one semiconductor module; and
a cooling case including at least one opening at a position corresponding to an inner surface of said circuit case so that a surface of the cooling case which is located opposite a semiconductor module mounting surface is in contact with a cooling liquid, wherein a clamping section is provided outside said circuit case and used to clamp said cooling case with bolts. - View Dependent Claims (8, 9)
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Specification