Power inverter

• US 20010014029A1
• Filed: 02/16/2001
• Published: 08/16/2001
• Est. Priority Date: 02/16/2000
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Yasukawa, Akio, Suzuki, Osamu, Hombu, Mitsuyuki, Sasaki, Kaname, Yamamura, Hirohisa, Obara, Sanshirou, Kuwabara, Heikichi
• Granted Patent: US 6,414,867 B2
• Time in Patent Office: Days
• US Class Current: 363/141
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and leads from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inn or outside the second seal.

Claims

1. A power inverter, comprising:

at least one semiconductor module having a plurality of power inverting semiconductor elements mounted therein; and

a cooling case containing a cooling liquid for cooling said at least one semiconductor module,

wherein said at least one semiconductor module comprises a semiconductor element and an electric circuit on a radiating plate, and an upper case containing said semiconductor elements and electric circuits is provided on said radiating plate, and

said cooling case has a cooling channel in which the cooling liquid flows and at least one opening for bring said radiating plate in contact with the cooling liquid flowing in said cooling channel, and

a first seal portion is provided at a circumference of said at least one opening, and

an annular groove is formed at a circumference of said first seal portion, and

at least one liquid relieving hole is formed in said annular groove, said hole leading from said groove to a surface of the cooling case other than the surface of the cooling case in contact with said radiating plate.

2. The power inverter according to

claim 1

, wherein means for clamping said radiating plate and said cooling case together is provided outside said groove and outside said upper case.

3. The power inverter according to

claim 2

, wherein a second seal portion is provided outside said groove, and said clamping means is provided in or outside said second seal portion.

4. The power inverter according to

claim 2

, wherein said clamping means comprises a bolt and a threaded bolt hole provided in said radiating plate at said first seal portion, and said threaded bolt hole has a length not extending through said radiating plate.

5. The power inverter according to

claim 1

, wherein means for detecting leakage of the cooling liquid is provided in said groove.

6. A power inverter, comprising:

at least one semiconductor module having a plurality of power inverting semiconductor elements mounted therein; and

a heat sink for cooling said at least one semiconductor module,

wherein said heat sink includes a cooling channel and at least one opening in communication with said channel, and

a seal portion is provided outside said at least one opening to maintain liquid tightness against a cooling liquid, and

a liquid relieving gap is formed outside said seal portion and on a member forming the heat sink, said gap leading to a surface of the heat sink other than the surface of the heat sink on which said at least one semiconductor module is mounted.

7. A power inverter, comprising:

a circuit case accommodating at least one semiconductor module; and

a cooling case including at least one opening at a position corresponding to an inner surface of said circuit case so that a surface of the cooling case which is located opposite a semiconductor module mounting surface is in contact with a cooling liquid,

wherein a clamping section is provided outside said circuit case and used to clamp said cooling case with bolts.

8. The power inverter according to

claim 7

, wherein an annular groove that is not in communication with said at least one opening is formed on an outer peripheral side of said at least one opening in said cooling case.

9. The power inverter according to

claim 8

, wherein a seal portion is provided between said at least one opening in said cooling case and said groove.