ORGANIC LIGHT EMITTING DEVICES
First Claim
1. A multicolor light emitting device (LED) structure, comprising:
- a plurality of at least a first and a second light emitting organic device (LED) stacked one upon the other, to form a layered structure, with each LED separated one from the other by a transparent conductive layer to enable each device to receive a separate bias potential to operate to emit light through the stack.
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Accused Products
Abstract
A multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds. The vertical stacked structure is formed on a glass base having a transparent coating of ITO or similar metal to provide a substrate. Deposited on the substrate is the vertical stacked arrangement of three double heterostructure devices, each fabricated from a suitable organic material. Stacking is implemented such that the double heterostructure with the longest wavelength is on the top of the stack. This constitutes the device emitting red light on the top with the device having the shortest wavelength, namely, the device emitting blue light, on the bottom of the stack. Located between the red and blue device structures is the green device structure. The devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures while further enabling each of the devices to receive a selective bias.
273 Citations
111 Claims
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1. A multicolor light emitting device (LED) structure, comprising:
a plurality of at least a first and a second light emitting organic device (LED) stacked one upon the other, to form a layered structure, with each LED separated one from the other by a transparent conductive layer to enable each device to receive a separate bias potential to operate to emit light through the stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A multicolor light emitting device structure, comprising:
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a transparent substrate layer having deposited on a surface a first transparent conductive coating;
a first light emitting device deposited on said first transparent conductive coating;
a second transparent conductive coating deposited on the surface of said first device not in contact with said first coating;
a second light emitting device deposited on the surface of said second coating;
a third transparent conductive coating deposited on the surface of said second device not in contact with said second coating;
a third light emitting device deposited on the surface of said third coating; and
a further conductive coating deposited on the surface of said third device not in contact with said third coating. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A multicolor display, comprising:
a plurality of multicolor light emitting device pixel structures arranged in rows and columns to provide a display surface with each pixel structure consisting of at least one multicolor light emitting device structure wherein each device structure comprises first, second and third light emitting devices (LED'"'"'s) stacked one upon the other to form a layered structure, with each LED separated by a transparent conductive layer, and whereby said display can be biased via said conductive layers to cause said multicolor light emitting devices to emit light when biased. - View Dependent Claims (40, 41, 42, 43, 44)
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45. A method of fabricating a multicolor light emitting device (LED) structure comprising the steps of:
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forming a first transparent conductive layer upon a transparent substrate;
depositing a first hole transporting layer upon said first transparent conductive layer;
depositing a first organic emission layer upon said first hole transporting layer to provide a first emission color;
depositing a first electron transporting layer upon said first emission layer;
depositing a second transparent conductive layer upon said first electron transporting layer, said second transparent conductive layer adapted to receive a first bias potential;
depositing a second hole transporting layer upon said second transparent conductive layer;
depositing a second organic emission layer upon said second hole transporting layer to provide a second emission color;
depositing a second electron transporting layer upon said second emission layer; and
depositing a third transparent conductive layer upon said second electron transporting layer, said third transparent conductive layer adapted to receive a second bias potential. - View Dependent Claims (46, 47)
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48. A method of fabricating a hermetically packaged multicolor light emitting device (LED), comprising the steps of:
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forming a first transparent conductive layer upon a transparent substrate;
masking said first conductive layer for depositing an SiO2 layer thereupon in a concentric pattern;
forming on a portion of said first SiO2 layer at least one multicolor LED, each including at least a first and a second organic light emitting devices (LED'"'"'s) stacked one upon the other to form a layered structure upon said first SiO2 layer;
depositing via shadow masking a plurality of metal contacts or circuit paths each having one end terminating near an outer edge of said first SiO2 layer, and each having another end terminating on an individual biasing electrode of said at least one multicolor LED;
depositing via shadow masking a second SiO2 layer as a ring concentric with said first SiO2 layer and over outer portions of said plurality of metal contacts but leaving exposed said one ends thereof;
depositing a ring of low temperature melting solder over and concentric with said second SiO2 ring;
depositing on the bottom of a cover glass a metal ring positioned to be coincident with said ring of solder;
installing said cover glass over said substrate and at least one multicolor LED, with said ring of solder abutting against said metal ring on said cover glass;
placing said assembly in an inert gas atmosphere; and
heating said ring of solder to melt the solder for both forming an air tight seal, and entrapping said inert gas in an interior region between the bottom of said cover glass and underlying substrate. - View Dependent Claims (49, 50, 51, 52, 53, 54)
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55. A multicolor, energizable, light emitting structure, comprising:
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at least three layers of conductive material;
a transparent, energizable, light emitting device (LED) disposed between adjacent ones of said layers of conductive material, respectively, so that said LEDs are stacked on each other with one of said layers of conductive material disposed between each two of said LEDs and the other layers of conductive material are disposed on the outside of said LEDs;
said layers of conductive material disposed between adjacent ones of said LEDs and one of said outside layers being substantially transparent; and
means on each of said layers of conductive material for being connected to a bias for selectively energizing each of said LEDs. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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71. An energizable, light emitting structure, comprising:
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a transparent substrate;
a first layer of substantially transparent, electrically conductive material supported on said substrate;
a transparent, energizable, light emitting device (LED) supported on said first layer of substantially transparent, electrically conductive material, said LED including an emission layer;
a second layer of electrically conductive material supported by said LED; and
said LED being operative to produce light and transmit it through said transparent substrate when energized. - View Dependent Claims (72, 73, 74, 75, 76)
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77. A multicolor, energizable, light emitting display comprising:
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a plurality of energizable, light emitting structures;
each of said structures comprising a plurality of transparent, light emitting devices (LED) that are stacked on each other;
each of said LEDs in each of said structures being operative to emit a different color light when energized; and
means for selectively energizing at least one of said LEDs in each of said structures so that the color produced by each of said light;
emitting structures is determined by which LED or LEDs in each light emitting structure is energized so that light emitted from said structures creates an image having a predetermined shape and color. - View Dependent Claims (78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100)
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101. A method of fabricating a multicolor, energizable light emitting structure, comprising the steps of:
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providing a transparent substrate;
providing a first substantially transparent electrically conductive layer on said transparent substrate;
providing a first transparent, light emitting diode (LED) on said substrate, said first LED being operable when energized to emit a light of a first predetermined wavelength;
providing a second substantially transparent, electrically conductive layer on said first LED;
providing a second transparent, light emitting diode (LED) on said second substantially transparent, electrically conductive layer, said second LED being operable when energized to emit a light of a second predetermined wavelength, that is longer than said first predetermined wavelength; and
an electrically conductive layer on said second (LED). - View Dependent Claims (102, 103, 104, 105, 106, 107, 108, 109)
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110. A transparent energizable, light emitting device (LED), comprising:
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an emission layer, a hole transporting layer and an electron transporting layer;
said emission layer being disposed between said hole transporting layer and said electron transporting layer;
a first layer of substantially transparent electrically conductive material, and a second layer of electrically conductive material, said first layer being on said hole transporting layer, said second layer being on said electron transporting layer; and
said emission layer consists of material selected from the group consisting of trivalent metal quinolate complexes, trivalent metal bridged quinolate complexes, Schiff base divalent metal complexes, tin (iv) metal complexes, metal acetylacetonate complexes, metal bidentate ligand complexes, bisphosphonates, divalent metal maleonitriledithiolate complexes, molecular charge transfer complexes, aromatic and heterocyclic polymers and rare earth mixed chelates. - View Dependent Claims (111)
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Specification