Display device and method of manufacturing the same

• US 20010015256A1
• Filed: 01/11/2001
• Published: 08/23/2001
• Est. Priority Date: 01/17/2000
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakajima, Setsuo, Yamazaki, Shunpei
• Granted Patent: US 7,060,153 B2
• Time in Patent Office: Days
• US Class Current: 156/289
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/173 comprising banks or shadow masks
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y10S 156/924 Delaminating display screen, e.g. cathode-ray, LCD screen
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate
• CPC Class Codes: Y10T 156/1189 with shearing during delaminating

Abstract

To provide a technique for manufacturing a high-performance display device by employing a plastic substrate. A peeling layer is formed on an element-forming substrate, and a semiconductor element and a luminous element are further formed thereon. Then, a fixed substrate (130) is bonded on the luminous element by using a first adhesive (129). The entire substrate in this state is exposed in a gas containing halogen fluoride to thereby remove the peeling layer and separate the element-forming substrate. Thereafter, a bonding substrate (132) that comprises a plastic substrate is bonded in place of the separated element-forming substrate.

Claims

1. A method of manufacturing a display device, comprising the steps of:

forming a peeling layer on an element-forming substrate;

forming an insulating layer on said peeling layer;

forming a luminous element on said insulating layer;

bonding a fixed substrate on said luminous element by using a first adhesive;

exposing the entire substrate to a gas containing halogen fluoride after bonding said fixed substrate to thereby remove said peeling layer; and

bonding a bonding substrate to said insulating layer by using a second adhesive.

2. A method according to

claim 1

, wherein polyimide, acrylic, or epoxy resin is used as said first adhesive.

3. A method according to

claim 1

, wherein a material used for forming said bonding substrate is the same as that for forming said fixed substrate.

4. A method of manufacturing a display device, comprising the steps of:

forming a peeling layer on an element-forming substrate, forming an insulating layer on said peeling layer;

forming a semiconductor element on said insulating layer;

forming a luminous element that is electrically connected to said semiconductor element;

bonding a fixed substrate on said luminous element by using a first adhesive;

exposing the entire substrate to a gas containing halogen fluoride after bonding said fixed substrate to thereby remove said peeling layer; and

bonding a bonding substrate to said insulating layer by using a second adhesive.

5. A method according to

claim 4

, wherein polyimide, acrylic, or epoxy resin is used as said first adhesive.

6. A method according to

claim 4

, wherein a material used for forming said bonding substrate is the same as that for forming said fixed substrate.

7. A method of manufacturing a display device, comprising the steps of:

forming a peeling layer on an element-forming substrate;

forming an insulating layer on said peeling layer;

forming active layers, a gate insulating layer, and gate electrodes over said insulating layer;

forming first openings in said gate insulating layer, said insulating layer, and said peeling layer;

forming a first interlayer insulating layer to cover said gate electrodes;

forming wirings and a pixel electrode on said first interlayer insulating layer;

forming second opening in said first interlayer insulating layer, said gate insulating layer, and said insulating layer to thereby expose said peeling layer;

exposing the entire substrate to a gas containing halogen fluoride to thereby remove said peeling layer;

forming a second interlayer insulating layer to cover said wirings and said pixel electrode;

etching said second interlayer insulating layer to thereby expose said pixel electrode;

forming a luminous layer and a cathode on said pixel electrode;

bonding a fixed substrate on said cathode by using a first adhesive;

separating said element-forming substrate and said first interlayer insulating layer after bonding said fixed substrate; and

bonding a bonding substrate to said insulating layer by using a second adhesive.

8. A method according to

claim 7

, wherein polyimide, acrylic, or epoxy resin is used as said first adhesive.

9. A method according to

claim 7

, wherein a material used for forming said bonding substrate is the same as that for forming said fixed substrate.

10. A method of manufacturing a display device, comprising the steps of:

forming a peeling layer on an element-forming substrate;

forming an insulating layer on said peeling layer;

forming a first stripe electrode on said insulating layer;

bonding a fixed substrate having a second stripe electrode formed thereon on said element-forming substrate by a sealing member;

injecting a liquid crystal between said first stripe electrode and said second stripe electrode;

exposing the entire substrate to a gas containing halogen fluoride after injecting the liquid crystal to thereby remove said peeling layer; and

bonding a bonding substrate to said insulating layer by using a second adhesive.

11. A method according to

claim 10

, wherein polyimide, acrylic, or epoxy resin is used as said first adhesive.

12. A method according to

claim 10

, wherein a material used for forming said bonding substrate is the same as that for forming said fixed substrate.

13. A method of manufacturing a display device, comprising the steps of:

forming a peeling layer on an element-forming substrate;

forming an insulating layer on said peeling layer;

forming active layers, a gate insulating layer, and gate electrodes on said insulating layer;

forming a first interlayer insulating layer to cover said gate electrodes forming wirings and a pixel electrode on said first interlayer insulating layer;

bonding a fixed substrate that is provided with an opposing electrode on said element-forming substrate by a sealing member;

injecting a liquid crystal between said pixel electrode and said opposing electrode;

exposing the entire substrate to a gas containing halogen fluoride after injecting the liquid crystal to thereby remove said peeling layer; and

bonding a bonding substrate to said insulating layer by using a second adhesive.

14. A method according to

claim 13

, wherein polyimide, acrylic, or epoxy resin is used as said first adhesive.

15. A method according to

claim 13

, wherein a material used for forming said bonding substrate is the same as that for forming said fixed substrate.