Electroplating process for avoiding defects in metal features of integrated circuit devices

• US 20010015321A1
• Filed: 02/28/2001
• Published: 08/23/2001
• Est. Priority Date: 10/26/1998
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Smith, David, Henri, Jon, Reid, Jonathan D., Mayer, Steven T., Varadarajan, Sesha
• Granted Patent: US 6,793,796 B2
• Time in Patent Office: Days
• US Class Current: 205/103
• CPC Class Codes: C25D 3/38 of copper
• CPC Class Codes: C25D 5/18 Electroplating using modulated, pulsed or reversing current
• CPC Class Codes: C25D 5/617 Crystalline layers
• CPC Class Codes: C25D 5/627 Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H05K 3/423 characterised by electroplating method

Abstract

Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates having features with a range of aspect ratios, while providing good filling and thickness distribution. The methods include, in succession, applying DC cathodic current densities optimized to form a conformal thin film on a seed layer, to provide bottom-up filling, preferentially on features having the largest aspect ratios, and to provide conformal plating of all features and adjacent field regions. Including a leveling agent in the electroplating bath produces films with better quality after subsequent processing.

Claims

1. A method of electroplating a metal onto a surface comprising a field region and a plurality of recessed features, the recessed features having a range of aspect ratios, the surface having a metal seed layer, the method comprising:

contacting the surface with an electroplating solution comprising metal ions, a suppressor additive, an accelerator additive, and a leveler additive under conditions wherein the metal seed layer is cathodically polarized with respect to the electroplating solution prior to or less than approximately 5 seconds following the contacting;

applying a DC cathodic current density through the surface, the current density having a first value that is sufficiently small that depletion of metal ions and the additives is absent at both the field region and the recessed features, to create a substantially conformal thin conductive metal film on the surface;

applying a DC cathodic current density having a second value through the surface, the second value such that electroplating occurs preferentially on bottoms of recessed features having the largest aspect ratios;

increasing the current density from the second value until all recessed features have aspect ratios less than about 0.5; and

further increasing the current density to a third value that provides a condition of conformal plating, filling said recessed features and plating metal onto the field region.

2. The method of

claim 1

wherein the leveler additive comprises protonated nitrogen-based functional groups.

3. The method of

claim 1

wherein the concentration of the leveler additive in the electroplating solution is between about 1 and about 30 milligrams per liter.

4. The method of

claim 1

wherein the suppressor additive comprises a hydrophilic polymer.

5. The method of

claim 4

wherein the suppressor additive comprises polyethylene glycol.

6. The method of

claim 4

wherein the number of pit defects observed on the surface of the filled recessed features and the field region is smaller than the number of pit defects observed on a surface electroplated with an electroplating bath comprising a hydrophobic suppressor additive.

7. The method of

claim 1

wherein a height of protrusions over recessed features is less than a third of a height of protrusions over recessed features electroplated with an electroplating bath lacking a leveler additive.

8. The method of

claim 1

wherein the metal ions comprise copper ions.

9. The method of

claim 8

wherein the conformal thin conductive film is between about 25 and 400 angstroms thick.

10. The method of

claim 8

wherein the metal seed layer is cathodically polarized by applying a DC cathodic current density of between about 0.02 and about 5 milliamperes per square centimeter.

11. The method of

claim 8

wherein said first value is between about 0.2 and about 5 milliamperes per square centimeter.

12. The method of

claim 11

further comprising cathodic current pulses superimposed on said DC cathodic current density.

13. The method of

claim 12

wherein said current pulses have current densities of between about 25 and about 250 milliamperes per square centimeter and pulse lengths of between about 0.5 and about 10 milliseconds.

14. The method of

claim 11

further comprising alternating cathodic and anodic pulses superimposed on said DC cathodic current density.

15. The method of

claim 14

wherein said current pulses carry current densities of between about 25 and about 250 milliamperes per square centimeter and pulse lengths of between about 0.5 and about 10 milliseconds.

16. The method of

claim 11

wherein the second value is between about 0.2 and about 5 milliamperes per square centimeter.

17. The method of

claim 16

wherein increasing the current density from the second value until all recessed features have aspect ratios of less than about 0.5 is increasing the current density over a period of between about 3 and about 60 seconds to a maximum current density of between about 4 and about 45 milliamperes per square centimeter.

18. The method of

claim 17

wherein further increasing the current density to a third value that provides a condition of conformal plating is further increasing the current density to a value between about 15 and about 75 milliamperes per square centimeter.

19. A method of electroplating a metal onto a continuous conducting surface comprising a field region and a plurality of recessed features having a range of aspect ratios, the method comprising:

contacting the surface with an electroplating solution comprising metal ions, a suppressor additive, an accelerator additive, and a leveler additive;

applying a DC cathodic current density through the surface, the current density having a first value such that electroplating occurs preferentially on bottoms of recessed features having the largest aspect ratios;

increasing the current density from the first value until all recessed features have aspect ratios of less than about 0.5; and

further increasing the current density to a second value that provides a condition of conformal plating, filling said recessed features and plating metal onto the field region.

20. The method of

claim 19

wherein the leveler additive comprises protonated nitrogen-based functional groups.

21. The method of

claim 19

wherein the concentration of the leveler additive in the electroplating solution is between about 1 and about 30 milligrams per liter.

22. The method of

claim 19

wherein the metal ions comprise copper ions.