Printed-wiring substrate having lead pins

• US 20010015491A1
• Filed: 01/10/2001
• Published: 08/23/2001
• Est. Priority Date: 02/03/2000
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited
• Original Assignee: NGK Spark PLUG Company Limited
• Inventors: Shiraishi, Mitsuo
• Granted Patent: US 6,359,332 B2
• Time in Patent Office: Days
• US Class Current: 257/697
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A printed-wiring substrate including a substrate 101 having pin-bonding portions 111 formed on a main surface 104 thereof and lead pins 121. The lead pins 121 each have a flange 123 and a shaft portion 122 and being brazed to corresponding pin-bonding portions 111 via the corresponding flanges 123. A hemispherical convex shape is imparted to a bonding surface 124 of a flange 123. The flange 123 is used for brazing of a lead pin 121, and the bonding surface 124 faces a pin-bonding portion 111 of a substrate 101. A brazing filler metal 131 used for brazing of the lead pin 121 extends by wetting toward the tip end of the lead pin 121 beyond the outermost edge 127 of an opposite surface 126 of the flange 123, which is opposite the bonding surface 124 of the flange 123, such that an extension-by-wetting end of the brazing filler metal 131 is located between the outermost edge 127 and a shaft portion 122 of the lead pin 121. Since the solder 131 has no narrow portion, the bonding strength is not impaired.

Claims

1. A printed-wiring substrate comprising a substrate having pin-bonding portions formed on a main surface thereof and lead pins, the lead pins each having a flange and a shaft portion and being brazed to corresponding pin-bonding portions via the corresponding flanges, the flange having a convex portion formed on a bonding surface thereof in opposition to the pin-bonding portion, said printed-wiring substrate characterized in that:

a brazing filler metal brazing the lead pin to the pin-bonding portion extends by wetting toward the tip end of the lead pin beyond the outermost edge of a surface of the flange opposite the bonding surface such that the end of an extension of the brazing filler metal formed by wetting is located between the outermost edge and the shaft portion.

2. The printed-wiring substrate having lead pins as claimed in

claim 1

, wherein the entire bonding surface of the flange has a hemispherical form serving as the convex portion.

3. The printed-wiring substrate having lead pins as claimed in

claim 1

, wherein a portion of the bonding surface of the flange forms the convex portion.

4. The printed-wiring substrate having lead pins as claimed in

claim 3

, wherein the convex portion is located at the center of a bonding-surface side of the flange.

5. The printed-wiring substrate having lead pins as claimed in claims 1, wherein the diameter of a brazing surface of the pin-bonding portion is greater than the diameter of the flange.

6. The printed-wiring substrate having lead pins as claimed in

claim 1

, wherein the contour of a section of the brazing filler metal as sectioned by a plane including the axis of the shaft portion of the lead pin is substantially linear, and an angle 0 between the contour and the main surface of said printed-wiring substrate falls within the range of 55 to 80 degrees.

7. The printed-wiring substrate having lead pins as claimed in

claim 1

, wherein said printed-wiring substrate is formed from resin.