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Mounting method and apparatus of bare chips

  • US 20010016372A1
  • Filed: 02/16/2001
  • Published: 08/23/2001
  • Est. Priority Date: 02/22/2000
  • Status: Abandoned Application
First Claim
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1. A mounting method of bare chips to a mounting substrate, in which bump electrodes of each of said bare chips are connected electrically to pads of said mounting substrate via a resin film put between each of said bare chips and said mounting substrate, comprising the steps of:

  • forming bump electrodes of plural bare chips on a wafer in which said plural bare chips were formed at the same time;

    adhering a resin film on the surface where said bump electrodes were formed on said wafer tentatively;

    dividing said wafer into each of said plural bare chips having said resin film by dicing;

    mounting each of said plural bare chips having said resin film on said mounting substrate; and

    connecting said bump electrodes of each of said plural bare chips to said pads of said mounting substrate electrically by applying heat and pressure.

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