Mounting method and apparatus of bare chips

• US 20010016372A1
• Filed: 02/16/2001
• Published: 08/23/2001
• Est. Priority Date: 02/22/2000
• Status: Abandoned Application

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Murakami, Tomoo
• Application Number:
  US09/785,965
• Publication Number:
  US 20010016372A1
• Time in Patent Office: Days
• US Class Current: 438/113
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29355 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/2939 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29455 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/7531 of other parts
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor

Abstract

A mounting method and apparatus of bare chips to a mounting substrate, in which the bare chips can be mounted on the mounting substrate automatically and in a low cost, is provided. In particular, a mounting method and apparatus of bare chips to a mounting substrate, in which plural bare chips having various sizes are effectively mounted on the mounting substrate, is provided. At this mounting method of the bare chips to the mounting substrate, in which the bump electrodes of each of the bare chips are connected to pads of the mounting substrate electrically via a resin film put between the bare chip and the mounting substrate, hardening contraction strength of the resin film is utilized. First, the bump electrodes of plural bare chips are formed on a wafer at the same time. And a resin film is adhered tentatively on the surface where the bump electrodes were formed on the wafer by such as a vacuum laminating method. After this, the wafer is divided into each of the plural bare chips having the resin film by dicing. And each of the plural bare chips having the resin film is mounted on the mounting substrate. And the bump electrodes of each of the plural bare chips are connected to the pads of the mounting substrate electrically by applying heat and pressure. With this, compared with a conventional method, in which the bump electrodes of each of the bare chips are formed and a resin film whose size is equivalent to the size of each of the bare chips is supplied at the time when each of the bare chips is mounted on the mounting substrate, a large amount of the mounting cost is reduced at the present invention.

Claims

1. A mounting method of bare chips to a mounting substrate, in which bump electrodes of each of said bare chips are connected electrically to pads of said mounting substrate via a resin film put between each of said bare chips and said mounting substrate, comprising the steps of:

forming bump electrodes of plural bare chips on a wafer in which said plural bare chips were formed at the same time;

adhering a resin film on the surface where said bump electrodes were formed on said wafer tentatively;

dividing said wafer into each of said plural bare chips having said resin film by dicing;

mounting each of said plural bare chips having said resin film on said mounting substrate; and

connecting said bump electrodes of each of said plural bare chips to said pads of said mounting substrate electrically by applying heat and pressure.

2. A mounting method of bare chips to a mounting substrate in accordance with

claim 1

, wherein:

said adhering said resin film on said wafer tentatively is executed under reduced atmospheric pressure.

3. A mounting method of bare chips to a mounting substrate in accordance with

claim 1

, wherein:

said adhering said resin film on said wafer tentatively is executed under that heat is applied to said resin film at a temperature that said resin film is not hardened, and also under reduced atmospheric pressure.

4. A mounting method of bare chips to a mounting substrate in accordance with

claim 2

, wherein:

when said reduced atmospheric pressure is applied, pressure pushing said resin film to said wafer is also applied.

5. A mounting method of bare chips to a mounting substrate in accordance with

claim 3

, wherein:

when said reduced atmospheric pressure is applied, pressure pushing said resin film to said wafer is also applied.

6. A mounting method of bare chips to a mounting substrate in accordance with

claim 1

, wherein:

said resin film is a thermo-hardening type film and an anisotropic conductive film (ACF) whose hardening contraction coefficient is larger than its thermal expansion coefficient.

7. A mounting method of bare chips to a mounting substrate in accordance with

claim 1

, wherein:

said resin film is a thermo-hardening type film and a non-conductive film (NCF) whose hardening contraction coefficient is larger than its thermal expansion coefficient.

8. A mounting apparatus of bare chips to a mounting substrate, in which bump electrodes of each of said bare chips are connected electrically to pads of said mounting substrate via a resin film put between each of said bare chips and said mounting substrate, comprising;

bump forming equipment for forming bump electrodes of plural bare chips formed on a wafer at the same time;

resin film adhering equipment for tentatively adhering said resin film on the surface, where said bump electrodes of said plural bare chips were formed, of said wafer;

dicing equipment for dividing said wafer into each of said plural bare chips having said resin film; and

mounting equipment for mounting said each of said plural bare chips having said resin film on said mounting substrate and for connecting said bump electrodes of each of said plural bare chips to said pads of said mounting substrate by applying heat and pressure.

9. A mounting apparatus of bare chips to a mounting substrate in accordance with

claim 8

, wherein:

said resin film adhering equipment adheres said resin film on said wafer tentatively under reduced atmospheric pressure.

10. A mounting apparatus of bare chips to a mounting substrate in accordance with

claim 8

, wherein:

said resin film adhering equipment adheres said resin film on said wafer tentatively under that heat is applied to said resin film at a temperature that said resin film is not hardened, and also under reduced atmospheric pressure.

11. A mounting apparatus of bare chips to a mounting substrate in accordance with

claim 9

, wherein:

said resin film adhering equipment also applies pressure pushing said resin film to said wafer when said reduced atmospheric pressure is applied.

12. A mounting apparatus of bare chips to a mounting substrate in accordance with

claim 10

, wherein:

said resin film adhering equipment also applies pressure pushing said resin film to said wafer when said reduced atmospheric pressure is applied.

13. A mounting apparatus of bare chips to a mounting substrate in accordance with

claim 8

, wherein:

said resin film is a thermo-hardening type film and also a resin film whose hardening contraction coefficient is larger than its thermal expansion coefficient.