METHOD OF FORMING MULTILAYER CIRCUIT STRUCTURE

• US 20010018796A1
• Filed: 08/16/1999
• Published: 09/06/2001
• Est. Priority Date: 08/16/1999
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: LEE, MICHAEL G., WANG, WEN-CHOU, BEILIN, SOLOMON
• Application Number:
  US09/374,852
• Publication Number:
  US 20010018796A1
• Time in Patent Office: Days
• US Class Current: 29/830
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 38/1841 during laying up
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4638 Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A method for making a multilayer circuit structure using circuit substrates with apertures at edge regions is disclosed. The method includes using a roller element with teeth. The teeth are used to align the circuit substrates during a lamination process.

Claims

1. A method for forming a multilayer circuit structure, the method comprising:

aligning an aperture in a first circuit substrate and an aperture in a second circuit substrate, wherein the first circuit substrate is flexible;

inserting a tooth from a roller element into the aligned apertures of the first and the second circuit substrates;

rotating the roller element; and

laminating the first circuit substrate to the second circuit substrate.

2. The method of

claim 1

wherein laminating the first circuit substrate to the second circuit substrate comprises laminating the first and second circuit substrates together with a material disposed between the first and second circuit substrates.

3. The method of

claim 2

wherein the material comprises a dielectric material.

4. The method of

claim 2

wherein the material comprises a conductive material.

5. The method of

claim 2

wherein the material comprises solder.

6. The method of

claim 1

wherein laminating the first circuit substrate to the second circuit substrate comprises passing the first and second circuit substrate through a nip formed by the roller element and a body.

7. The method of

claim 6

wherein the body is has a flat surface.

8. The method of

claim 6

wherein the body has a curved surface.

9. The method of

claim 1

further comprising heating the first and second circuit substrates.

10. The method of

claim 1

wherein laminating the first circuit substrate to the second circuit substrate comprises applying pressure to the first and second circuit substrates.

11. The method of

claim 1

further comprising:

depositing a material on the second circuit substrate before laminating.

12. The method of

claim 11

wherein the material is a liquid dielectric material.

13. The method of

claim 11

wherein the material is a curable liquid dielectric material.

14. The method of

claim 11

wherein the material is an adhesive film.

15. The method of

claim 11

wherein the material is curable.

16. The method of

claim 11

wherein the material comprises a dielectric layer having discrete conductive deposits therein to provide communication between the first and second circuit substrates.

17. The method of

claim 1

wherein the first circuit substrate has plural apertures at opposite edge regions of the first circuit substrate.

18. The method of

claim 1

wherein the first circuit substrate has plural apertures at opposing edge regions and the second circuit substrate has plural apertures at opposing edge regions, and wherein the apertures on the first circuit substrate and the apertures on the second circuit substrate are mirror images.

19. The method of

claim 1

wherein the first circuit substrate comprises a flexible thermoplastic material.

20. The method of

claim 1

wherein the second circuit substrate is rigid.