Substrate processing apparatus and substrate processing method
First Claim
1. A substrate processing apparatus for performing a heat processing for a substrate coated with a resist containing at least one substance out of an acid generator, a dissolution inhibitor, and a polymer chain protecting group, and a solvent, comprising:
- a processing chamber having a space capable of being tightly closed;
a plate disposed in the space for mounting thereon the substrate coated with the resist;
a pressure reducing device for reducing a pressure in the tightly closed space; and
a controller for controlling the pressure reducing device to hold a pressure at a level at which the solvent contained in the resist volatilizes and the substance practically remains in the resist.
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Abstract
A controller controls the temperature of a hot plate and the degree of vacuum in a tightly closed space to a temperature and a pressure at levels at which a thinner contained in a resist applied to a wafer volatilizes and an acid generator, a quencher, and a polymer chain protecting group practically remain in the resist, for example, during heat processing. More specifically, the controller controls the temperature of the hot plate and the degree of vacuum in the tightly closed space to bring the temperature of the hot plate to about 40° C., and the degree of vacuum in the tightly closed space to approximately 5 Torr. Thereby, the heat processing can be performed for the wafer so that the acid generator is uniformly dispersed in the resist, or the quencher is uniformly formed on the front face of the resist without breakage of the polymer chain protecting group.
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Citations
19 Claims
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1. A substrate processing apparatus for performing a heat processing for a substrate coated with a resist containing at least one substance out of an acid generator, a dissolution inhibitor, and a polymer chain protecting group, and a solvent, comprising:
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a processing chamber having a space capable of being tightly closed;
a plate disposed in the space for mounting thereon the substrate coated with the resist;
a pressure reducing device for reducing a pressure in the tightly closed space; and
a controller for controlling the pressure reducing device to hold a pressure at a level at which the solvent contained in the resist volatilizes and the substance practically remains in the resist. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A substrate processing apparatus for performing a processing for a substrate coated with a resist containing at least one substance out of an acid generator, a dissolution inhibitor, and a polymer chain protecting group, and a solvent, comprising:
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a processing chamber having a space capable of being tightly closed;
a processing plate disposed in the space for processing the substrate coated with the resist at a room temperature or less;
a pressure reducing device for reducing a pressure in the tightly closed space; and
a controller for controlling a temperature of the processing plate and a degree of vacuum in the space to hold a temperature and a pressure at levels at which the solvent contained in the resist volatilizes, and the substance practically remains in the resist.
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17. A method of performing a heat processing for a substrate coated with a resist containing at least one substance out of an acid generator, a dissolution inhibitor, and a polymer chain protecting group, and a solvent, comprising the steps of:
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(a) performing a processing for the substrate at a reduced pressure and a temperature at levels at which the solvent contained in the resist volatilizes and the substance practically remains in the resist; and
(b) performing a cooling processing for the processed substrate. - View Dependent Claims (18, 19)
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Specification