Light extraction from color changing medium layers in organic light emitting diode devices

• US 20010026124A1
• Filed: 03/23/2001
• Published: 10/04/2001
• Est. Priority Date: 03/23/2000
• Status: Active Grant

• Current Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Original Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Inventors: Ghosh, Ama1kumar P., Liu, Yachin
• Granted Patent: US 7,233,026 B2
• Time in Patent Office: Days
• US Class Current: 313/504
• CPC Class Codes: H10K 50/85 Arrangements for extracting light from the devices
• CPC Class Codes: H10K 50/854 comprising scattering means
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]

Abstract

A method of reducing the internal reflected light in an OLED device comprising the step of either scattering light emitted from the OLED or removing light emitted from the OLED. An OLED device comprising a color changing medium film, a transparent substrate, and either a means for scattering light emitted from the OLED or a means for removing light emitted from the OLED such that the internal reflected light is reduced.

Claims

1. A method of reducing the internal reflection of light in an OLED device, comprising the steps of:

providing an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film;

introducing a plurality of transparent particles into the color changing media film;

emitting light from the color changing media film; and

scattering the light emitted from the color changing media film.

2. The method of reducing the internal reflection of light in an OLED device according to

claim 1

, wherein said step of introducing a plurality of transparent particles comprises introducing a plurality of glass particles.

3. The method of reducing the internal reflection of light in an OLED device according to

claim 1

, wherein said step of introducing a plurality of transparent particles comprises introducing a plurality of fused silica particles.

4. A method of reducing the internal reflection of light in an OLED device, comprising the steps of:

providing an OLED device, wherein the OLED device comprises a transparent substrate, a color changing media film, and a means for removing a portion of light emitted from the color changing media film;

emitting light from the color changing media film; and

removing a portion of emitted light with said means for removing a portion of light emitted from the color changing media film.

5. A method of reducing the internal reflection of light in an OLED device, comprising the steps of:

providing a transparent substrate;

roughening said transparent substrate;

providing an OLED device, wherein the OLED device comprises said roughened transparent substrate and a color changing media film;

emitting light from the color changing media film; and

scattering the light emitted from the color changing media film.

6. The method of reducing the internal reflection of light in an OLED device according to

claim 5

, wherein said step of roughening said transparent substrate comprises mechanically roughening said transparent substrate.

7. The method of reducing the internal reflection of light in an OLED device according to

claim 6

, wherein said step of mechanically roughening said transparent substrate comprises sand-blasting said transparent substrate.

8. A method of reducing the internal reflection of light in an OLED device, comprising the steps of:

providing an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film; and

printing at least one photoresist pattern on at least one side of the transparent substrate.

9. The method of reducing the internal reflection of light in an OLED according to

claim 8

, wherein said step of printing the at least one photoresist pattern on the at least one side of the transparent substrate comprises the step of using a laser interference lithograph to print the at least one photoresist pattern on the at least one side of the transparent substrate.

10. The method of reducing the internal reflection of light in an OLED according to

claim 8

, wherein said step of printing the at least one photoresist pattern on the at least one side of the transparent substrate comprises printing at least one high resolution, high density photoresist pattern on at least one side of the said transparent substrate.

11. The method of reducing the internal reflection of light in an OLED according to

claim 10

, wherein said step of printing at least one high resolution, high density photoresist pattern on at least one side of the said transparent substrate further comprises printing at least one highly uniform photoresist pattern on at least one side of the said transparent substrate.

12. The method of reducing the internal reflection of light in an OLED according to

claim 8

, further comprising the step of transferring the at least one photoresist pattern on at least one side of the transparent substrate to an another layer.

13. The method of reducing the internal reflection of light in an OLED according to

claim 12

, wherein said step of transferring that at least one photoresist pattern on at least one side of said transparent substrate to an another layer comprises transferring the at least one photoresist pattern on at least one side of the transparent substrate to an oxide layer.

14. An OLED device having a reduced amount of internal reflected light, which comprises:

an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film, wherein said color changing media film comprises a plurality of transparent particles.

15. The OLED device having a reduced amount of internal reflected light according to

claim 14

, wherein said plurality of transparent particles comprises a plurality of glass particles.

16. The OLED device having a reduced amount of internal reflected light according to

claim 14

, wherein said plurality of transparent particles comprises a plurality of fused silica particles.

17. An OLED device having a reduced amount of internal reflected light, which comprises:

an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film; and

means for removing a portion of emitted fluorescent light.

18. The OLED device having a reduced amount of internal reflected light according to

claim 17

, wherein said means for removing a portion of emitted fluorescent light comprises a micro-cavity structure.

19. An OLED device having a reduced amount of internal reflected light, which comprises:

an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film, wherein said transparent substrate comprises a roughened transparent substrate.

20. The OLED device having a reduced amount of internal reflected light according to

claim 19

, wherein said roughened transparent substrate comprises a mechanically roughened transparent substrate.

21. The OLED device having a reduced amount of internal reflected light according to

claim 20

, wherein said mechanically roughened transparent substrate comprises a sand-blasted transparent substrate.

22. An OLED device having a reduced amount of internal reflected light, which comprises:

an OLED device, wherein the OLED device comprises a transparent substrate and a color changing media film, wherein said transparent substrate comprises at least one photoresist pattern printed on at least one side of said transparent substrate.

23. The OLED device having a reduced amount of internal reflected light according to

claim 22

, wherein said at least one photoresist pattern printed on at least one side of said transparent substrate is printed using a laser interference lithography.

24. The OLED device having a reduced amount of internal reflected light according to

claim 23

, wherein said at least one photoresist pattern printed on at least one side of said transparent substrate comprises at least one high resolution, high density photoresist pattern printed on at least one side of said transparent substrate.

25. The OLED device having a reduced amount of internal reflected light according to

claim 24

, wherein said at least one high resolution, high density photoresist pattern printed on at least one side of said transparent substrate comprises at least one highly uniform photoresist pattern.

26. The OLED device having a reduced amount of internal reflected light according to

claim 22

, wherein said at least one photoresist pattern printed on at least one side of said transparent substrate is transferred to an another layer.

27. The OLED device having a reduced amount of internal reflected light according to

claim 26

, wherein said another layer is an oxide layer.