Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same

• US 20010027876A1
• Filed: 03/16/2001
• Published: 10/11/2001
• Est. Priority Date: 03/24/2000
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Shimamoto, Takeshi, Tsukamoto, Masahide, Tateishi, Fumikazu, Yamaguchi, Kazufumi
• Granted Patent: US 6,888,072 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2224/73251 on different surfaces
• CPC Class Codes: H01L 2224/81901 Pressing the bump connector against the bonding areas by means of another connector
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10T 29/49137 Different components

Abstract

A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.

Claims

1. A fixture, comprising:

a base with an opening in its center portion;

a movable pawl provided on the base for fixing an electronic component; and

at least one pair of positioning walls for positioning the electronic component.

2. The fixture according to

claim 1

, wherein the movable pawl is supported by the base through a thin-wall part having a relatively thin wall thickness so as to be in an elastically displaceable state.

3. The fixture according to

claim 2

, wherein a wall thickness of the base is thicker than that of the thin-wall part.

4. The fixture according to

claim 2

, wherein the thin-wall part has a cross-sectional shape bent or curved in a substantially C-, J-, or V-shaped form.

5. The fixture according to

claim 1

, wherein the base has a substantially rectangular frame-like planar shape with an opening in its center portion.

6. The fixture according to

claim 5

, wherein the movable pawl is formed at least on one side of four sides excluding four corners.

7. The fixture according to

claim 1

, wherein a slope with its lower end located on a side of the opening is formed on an upper portion of the movable pawl.

8. The fixture according to

claim 1

, wherein the at least one pair of positioning walls are inner wall faces of the base.

9. The fixture according to

claim 1

, wherein an end face of the movable pawl functions as the at least one pair of positioning walls.

10. The fixture according to

claim 1

, wherein the movable pawl and the at least one pair of positioning walls are formed of an insulating material.

11. The fixture according to

claim 1

, wherein the base, the movable pawl, and the at least one pair of positioning walls are formed integrally using the same material.

12. A circuit board with a fixture, comprising;

a fixture mounted on a circuit board, for placing an electronic component; and

electrodes formed on the circuit board with the fixture,

wherein the fixture comprises a movable pawl for fixing an electronic component and at least one pair of positioning walls for positioning an electronic component, and

the electrodes are exposed between the at least one pair of positioning walls.

13. The circuit board with a fixture according to

claim 12

, wherein the movable pawl is supported through a thin-wall part having a relatively thin wall thickness so as to be in an elastically displaceable state.

14. The circuit board with a fixture according to

claim 13

, wherein the fixture is fixed to the circuit board by adhering thereto by its bottom face, and

a wall thickness of the fixture at the bottom face is thicker than that of the thin-wall part.

15. The circuit board with a fixture according to

claim 13

, wherein the thin-wall part has a cross-sectional shape bent or curved in a substantially C-, J-, or V-shaped form.

16. The circuit board with a fixture according to

claim 12

, wherein the fixture has a substantially rectangular frame-like planar shape with an opening in its center portion.

17. The circuit board with a fixture according to

claim 16

, wherein the movable pawl is formed at least on one side of four sides excluding four corners.

18. The circuit board with a fixture according to

claim 12

, wherein a slope with its lower end located on a side where the electronic component is positioned is formed on an upper portion of the movable pawl.

19. The circuit board with a fixture according to

claim 12

, wherein the circuit board with a fixture has a first surface provided with the fixture and the electrodes and a second surface opposite to the first surface, and electrodes connected to the electrodes formed on the first surface are formed on the second surface.

20. An electronic-component mounted body, comprising:

a circuit board with electrodes;

a fixture; and

an electronic component with electrodes,

the electronic component being placed on the circuit board using the fixture,

wherein the fixture comprises a movable pawl and at least one pair of positioning walls,

the movable pawl fixes the electronic component to the circuit board,

the at least one pair of positioning walls control a position of the electronic component in a direction parallel to a surface of the circuit board with the electronic component placed therebetween, and

the electrodes of the electronic component are connected to the electrodes on the circuit board formed between the at least one pair of positioning walls.

21. The electronic-component mounted body according to

claim 20

, wherein the movable pawl presses the electronic component toward the circuit board.

22. The electronic-component mounted body according to

claim 20

, wherein the electronic component is a semiconductor chip, a BGA, or a CSP.

23. The electronic-component mounted body according to

claim 20

, wherein the electrodes of the electronic component and the electrodes on the circuit board are connected to each other with a conductive adhesive interposed therebetween.

24. The electronic-component mounted body according to

claim 20

, further comprising bumps formed on the electrodes of the electronic component or on the electrodes on the circuit board.

25. The electronic-component mounted body according to

claim 24

, wherein the bumps and the electrodes on which the bumps are not formed are connected to each other with a conductive adhesive interposed therebetween.

26. The electronic-component mounted body according to

claim 20

, further comprising a fixing plate with a larger outer dimension than that of the electronic component,

wherein the fixing plate is attached to the electronic component,

the movable pawl indirectly fixes the electronic component through the fixing plate, and

the at least one pair of positioning walls indirectly control a position of the electronic component through the fixing plate.

27. The electronic-component mounted body according to

claim 26

, wherein the fixing plate and the at least one pair of positioning walls are formed to have shapes engaging with each other, and with the shapes, a position of the fixing plate is controlled and/or the fixing plate is fixed.

28. The electronic-component mounted body according to

claim 26

, wherein a slope is formed at a periphery of a lower face of the fixing plate.

29. The electronic-component mounted body according to

claim 26

, wherein the fixing plate is attached to the electronic component with an elastic adhesive layer interposed therebetween.

30. A method of manufacturing an electronic-component mounted body, comprising:

providing a circuit board provided with a fixture and electrodes, the fixture having a movable pawl and at least one pair of positioning walls, and the electrodes being formed to be exposed between the at least one pair of positioning walls; and

connecting electrodes of an electronic component and the electrodes on the circuit board by fitting the electronic component between the at least one pair of positioning walls and fixing the electronic component by the movable pawl.

31. The method of manufacturing an electronic-component mounted body according to

claim 30

, further comprising conducting a continuity test for connections between the electrodes of the electronic component and the electrodes on the circuit board after connecting them.

32. The method of manufacturing an electronic-component mounted body according to

claim 31

, further comprising, after conducting the continuity test, injecting an underfill between the electronic component and the circuit board.

33. The method of manufacturing an electronic-component mounted body according to

claim 31

, further comprising, after conducting the continuity test, sealing the electronic component with resin.