SEMICONDUCTOR APPARATUS SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING THEREOF AND ELECTRONIC APPARATUS

• US 20010030357A1
• Filed: 02/05/1999
• Published: 10/18/2001
• Est. Priority Date: 02/17/1998
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: MURATA, AKIHIRO
• Granted Patent: US 6,483,184 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15183 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15184 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A substrate for a semiconductor apparatus, a semiconductor apparatus and a method of manufacturing thereof and an electronic apparatus are provided that achieve excellent productivity and cost reduction. A semiconductor apparatus is formed from a substrate and a semiconductor device wire-bonded thereto. The substrate includes a substrate main body and pluralities of leads formed on a mounting surface of the substrate on which the semiconductor device is mounted. Conduction sections electrically connected to each of the leads define at least a part of external terminals. The leads have portions located under the semiconductor device, with the remaining portions located outside the semiconductor device depending upon the size of the semiconductor device.

Claims

1. A semiconductor apparatus substrate for mounting a semiconductor device thereon to form a semiconductor apparatus, comprising:

a substrate member having a mounting surface for mounting the semiconductor device;

a plurality of leads supported by the mounting surface of the substrate member for wire-bonding to the semiconductor device;

a conduction section electrically connected to each of the leads to thereby form at least a part of an external terminal, at least one of the leads having a portion not located under the semiconductor device and a remaining portion not located under the semiconductor device depending on the size of the semiconductor device.

2. The semiconductor apparatus substrate according to

claim 1

, the conduction section extending between a side surface of the substrate member and an opposite surface opposite to the mounting surface of the substrate member.

3. The semiconductor apparatus substrate according to

claim 1

, further comprising at least one substrate through-hole formed in the substrate member for each of the leads, the conduction section being formed on the opposite surface of the substrate member and being electrically connected to each of the leads through the substrate through-holes.

4. The semiconductor apparatus substrate according to

claim 3

, the at least one substrate through-hole communicating with a lead through-hole defined in each of the leads, and each of the leads having at least one wide region for forming the lead through-hole and the plurality of leads being disposed such that the wide regions thereof are positioned in a staggered fashion.

5. The semiconductor apparatus substrate according to

claim 3

, wherein the plurality of leads extend radially from a peripheral area toward a central area of the substrate member.

6. The semiconductor apparatus substrate according to

claim 5

, ones of the plurality of leads extending to corner portions of the semiconductor device to be mounted extending farther toward the central area of the substrate than others of the plurality of leads.

7. The semiconductor apparatus substrate according to

claim 5

, one of the through-holes being provided for each of the leads, and the substrate through-holes being formed in the peripheral area of the substrate member.

8. A semiconductor apparatus comprising:

a semiconductor device having a plurality of electrodes and a substrate defining a mounting surface for mounting the semiconductor device, the substrate having a plurality of leads supported by the mounting surface and a conduction section electrically connected to each of the leads to thereby form at least a part of an external terminal,

the semiconductor device being mounted on a lead forming surface of the substrate on which a plurality of leads are formed,

at least one of the leads having a portion located under the semiconductor device and a remaining portion not located under the semiconductor device, and

the electrodes of the semiconductor device being wire-bonded to the respective leads.

9. The semiconductor apparatus according to

claim 8

,

the semiconductor device being mounted on the substrate on a surface thereof opposite to the lead forming surface,

each of the electrodes of the semiconductor device being connected to each of the leads by a wire, and

the at least one lead having one portion located under the semiconductor device being connected to the wire outside of the semiconductor device.

10. The semiconductor apparatus according to

claim 8

, further comprising an insulation member provided between the semiconductor device and the substrate.

11. The semiconductor apparatus according to

claim 8

,

the conduction section being formed on an opposite surface opposite to the lead forming surface of the substrate,

the substrate including a substrate through-hole for each of the conduction sections, each of the conduction sections being electrically connected to each of the leads through the substrate through-hole,

a plurality of the conduction sections being disposed at predetermined pitches, and

the external terminals being formed only on at least every other conduction section.

14. An electronic apparatus having a circuit substrate provided with the semiconductor apparatus

claim 8

.

12. A method for manufacturing a semiconductor apparatus, comprising:

preparing a substrate having a plurality of leads supported by one surface thereof and a conduction section to be electrically connected to each of the leads to thereby form at least a part of an external terminal;

mounting a semiconductor device on a part of at least one of the leads to thereby attach the semiconductor device to the substrate; and

wire-bonding electrodes of the semiconductor device to the leads.

13. The method for manufacturing a semiconductor apparatus according to

claim 12

,

the semiconductor device being mounted on an opposite surface of the substrate opposite to the one surface,

the electrodes of the semiconductor device being connected to the leads by wires, and

the leads having portions located under the semiconductor device being connected by the wires to portions of the electrodes not located under the semiconductor device.

15. An electric apparatus having a semiconductor apparatus manufactured according to the method of

claim 12

.