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High performance heat exchange assembly

  • US 20010032720A1
  • Filed: 03/13/2001
  • Published: 10/25/2001
  • Est. Priority Date: 03/14/2000
  • Status: Active Grant
First Claim
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1. A heat sink for electrical or electronic components comprising:

  • a heat spreader plate to which the components to be cooled are connected;

    at least two heat conducting fins that are positioned substantially parallel to one another and which are connected substantially perpendicular to said heat spreader plate; and

    highly porous heat conducting reticulated foam block that fills the space between parallel fins.

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