High performance heat exchange assembly
First Claim
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1. A heat sink for electrical or electronic components comprising:
- a heat spreader plate to which the components to be cooled are connected;
at least two heat conducting fins that are positioned substantially parallel to one another and which are connected substantially perpendicular to said heat spreader plate; and
highly porous heat conducting reticulated foam block that fills the space between parallel fins.
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Abstract
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.
37 Citations
20 Claims
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1. A heat sink for electrical or electronic components comprising:
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a heat spreader plate to which the components to be cooled are connected;
at least two heat conducting fins that are positioned substantially parallel to one another and which are connected substantially perpendicular to said heat spreader plate; and
highly porous heat conducting reticulated foam block that fills the space between parallel fins. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of making a heat sink comprising a heat spreader plate, at least two fins and reticulated foam block that fills the space in-between the fins comprising,
selecting said heat spreader plate, said fins and said foam block; -
assembling said fins and said foam block onto said spreader plate so that said fins are substantially parallel to one another and substantially perpendicular to said spreader plate and said foam block fill the space in between said fins; and
bonding the assembly of said fins and said foam block to said spreader plate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of cooling electronic components by attaching the electronic components to one surface of a heat sink and passing a cooling fluid over the opposing surface of the heat sink, wherein said heat sink comprises,
a heat spreader plate, at least two heat conducting fins that are positioned substantially parallel to one another and which are connected substantially perpendicular to said heat spreader plate, and highly porous heat conducting reticulated foam block that fills the space between parallel fins, wherein the height of said fins, b, and is determined by the relationship, -
k f δ f h where, kf is the thermal conductivity of the selected fin material, Btu/ft s °
F.δ
f is the fin thickness, fth is the convective heat transfer coefficient for the foam-filled space bounded by the fins and the spreader plate, Btu/ft2 s °
F., and where h is given by the formula,where, n is the linear density of the foam material, pores per ft Φ
is the foam porosity expressed as a fractionρ
is the density of the flowing fluid, lbmft3k is the thermal conductivity of the flowing fluid, Btu/ft s °
F.cp is the isobaric specific heat of the flowing fluid, Btu/lbm °
F.μ
is the dynamic viscosity of the flowing fluid, lbm/ft sum is the mean velocity of the flowing fluid, ft/s and wherein the fin spacing, a, is determined by the relationship, a=Φ
δwhere, Φ
is between 1 to 6 6, ft, is determined by the relation,where, c is the selected fin length in the flow direction, ft k is the thermal conductivity of the flowing fluid, Btu/ft s °
F.ρ
is the density of the flowing fluid lbmft3cp is the isobaric specific heat of the flowing fluid, Btu/lbm°
F.um is the mean velocity of the flowing fluid, ft/s. - View Dependent Claims (17, 18, 19, 20)
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Specification