Surface acoustic wave device and method for manufacturing the same

• US 20010033120A1
• Filed: 05/18/2001
• Published: 10/25/2001
• Est. Priority Date: 09/20/1999
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kobayashi, Reiko, Furukawa, Osamu
• Application Number:
  US09/859,336
• Publication Number:
  US 20010033120A1
• Time in Patent Office: Days
• US Class Current: 310/313B
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Abstract

A surface acoustic wave element constituted by forming a comb electrode and a terminal electrode on a piezoelectric element and a base substrate including an element connection terminal and an external connection terminal are opposed to each other, the terminal electrode and the element connection terminal are connected to each other, and the peripheries of the base substrate and the surface acoustic wave element are sealed with a sealing member and bonded to each other.

Claims

1. A surface acoustic wave device comprising:

a base substrate having an external connection terminal and an element connection terminal electrically connected to the external connection terminal;

a surface acoustic wave element arranged opposite to the base substrate and having a piezoelectric element, a comb electrode and a terminal electrode connected thereto being formed on an inner major surface of the piezoelectric element;

a connection member for connecting the element connection terminal and the terminal electrode; and

a frame-like resin member whose side continues with one side of the piezoelectric element and the base substrate, the frame-like resin member being sandwiched between an inner major surface of the base substrate and the inner major surface of the piezoelectric element, and holding and bonding the base substrate and the piezoelectric element with a predetermined gap therebetween.

2. The surface acoustic wave device according to

claim 1

, wherein the frame-like resin member is formed of a conductive adhesive.

3. The surface acoustic wave device according to

claim 2

, wherein the connection member is formed of a conductive adhesive.

4. The surface acoustic wave device according to

claim 1

, wherein the frame-like resin member is formed of an insulative adhesive.

5. The surface acoustic wave device according to

claim 1

, wherein the surface acoustic wave element and the base substrate are formed to have substantially the same outside shape.

6. A method for manufacturing a surface acoustic wave device, comprising:

a first step of forming a comb electrode and a terminal electrode electrically connected thereto on each of a plurality of piezoelectric elements into which a piezoelectric wafer is cut, thereby forming a plurality of surface acoustic wave elements;

a second step of forming a metal bump on the terminal electrode of each of the surface acoustic wave elements;

a third step of forming an external connection terminal and an element connection terminal electrically connected thereto on each of a plurality of base substrates into which a base plate is cut;

a fourth step of applying a resin member to a frame-like periphery of each of the plurality of base substrates;

a fifth step of facing the surface acoustic wave element and the base substrate each other such that the terminal electrode and the element connection terminal are connected to each other through the metal bump; and

a sixth step of curing the resin member to bond the surface acoustic wave element and the base substrate to each other.

7. The method according to

claim 6

, wherein the resin member is formed on the base substrate by screen printing.