Apparatus and method for applying process solution
First Claim
1. A process solution applying apparatus comprising:
- a substrate holding mechanism for holding a substrate;
a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, said process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied; and
a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
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Abstract
A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
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Citations
13 Claims
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1. A process solution applying apparatus comprising:
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a substrate holding mechanism for holding a substrate;
a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, said process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied; and
a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A process solution applying method comprising:
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a substrate holding step of holding a substrate;
a process solution discharging step of discharging process solution to apply the process solution to the substrate in a predetermined amount at a rate which accords with the type of the process solution, thereby to form a film having high thickness uniformity; and
a substrate rotating step for rotating the substrate at a predetermined speed, thereby to spread the process solution over the substrate by virtue of centrifugal force. - View Dependent Claims (11, 12, 13)
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Specification