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Method and apparatus for cutting a semiconductor wafer

  • US 20010040152A1
  • Filed: 05/02/2001
  • Published: 11/15/2001
  • Est. Priority Date: 05/09/2000
  • Status: Active Grant
First Claim
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1. A method for cutting a semiconductor wafer, said method comprising the following steps of:

  • adhering a mount tape on a back surface of said semiconductor wafer, said mount tape comprising a resin base and a mesh-like member made of a material harder than that of said resin base and embedded in said resin base; and

    ejecting a beam-like liquid jet toward a front surface of said semiconductor wafer and simultaneously transmitting a laser beam axially through said beam-like liquid jet, so that said semiconductor wafer is cut into individual pieces by said laser beam together with said resin base of the mount tape, while said mesh-like member remains in its connected state.

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