Asymmetric ram cell

• US 20010043486A1
• Filed: 03/19/2001
• Published: 11/22/2001
• Est. Priority Date: 02/02/2000
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Donald R. Weiss, Samuel D. Naffziger
• Inventors: Weiss, Donald R., Naffziger, Samuel D.
• Granted Patent: US 6,363,006 B2
• Time in Patent Office: Days
• US Class Current: 365/154
• CPC Class Codes: G11C 11/412 using field-effect transistors only
• CPC Class Codes: Y10S 257/903 FET configuration adapted for use as static memory cell

Abstract

A single-ended read, differential write CMOS SRAM cell has two inverters connected in a regenerative feedback circuit. Each inverter includes two complementary FETs. FETs of the same type in each inverter have differing gate widths and/or drive currents.

Claims

1. A static random access memory cell including bit and nbit lines and a word line, the cell being arranged to be read by enabling the bit line while a voltage of predetermined polarity is applied to the word line and to have a bit written in it by applying complementary voltages to the bit and nbit lines while the voltage of predetermined polarity is applied to the word line, the cell comprising first and second inverters connected to each other to form a regenerative feedback circuit, each of the inverters including first and second complementary field effect transistors, gate electrodes of the field effect transistors of the first inverter being selectively connected to the bit-line in response to the voltage of predetermined polarity being applied to the word line, gate electrodes of the field effect transistors of the second inverter being connected to the nbit line in response to the voltage of predetermined polarity being applied to the word line, each of the gate electrodes being associated with a metal oxide gate region, the gate region of the first field effect transistor of the first inverter having a width that is substantially larger than the gate region of the first field effect transistor of the second inverter, the first field effect transistors of the first and second inverters being of the same conductivity type.

2. The static random access memory cell of

claim 1

wherein many of said cells are included in a memory having many of said bit, nbit and word lines.

3. The static random access memory cell of

claim 2

wherein the gate region of the field effect transistor of the second conductivity type of the first inverter has a width that is substantially larger than the gate region of the field effect transistor of the second conductivity type of the second inverter.

4. The static random access memory cell of

claim 3

wherein the gate region widths of the transistors of the second inverter are approximately the same.

5. The static random access memory cell of

claim 4

wherein each of the first field effect transistors is an N-channel field effect transistor, the first field effect transistor of the first inverter having a greater gate region width than any of the other field effect transistors of the first and second inverters.

6. The static random access memory cell of

claim 5

wherein the second field effect transistor of the first inverter is a P-channel field effect transistor having a greater gate region width than all the transistors of the second inverter.

7. The static random access memory cell of

claim 1

wherein the gate region of the field effect transistor of the second conductivity type of the first inverter has a width that is substantially larger than the gate region width of the field effect transistor of the second conductivity type of the second inverter.

8. The static random access memory cell of

claim 1

wherein the gate region widths of the first and second transistors of the second inverter are approximately the same.

9. The static random access memory cell of

claim 1

wherein the first field effect transistor of each inverter is an N-channel field effect transistor, the first field effect of the first inverter having a greater gate region width than any of the other first and second field effect transistors of the first and second inverters.

10. The static random access memory cell of

claim 1

wherein the second field effect transistor of the first inverter is a P-channel field effect transistor having a greater gate region width than the first and second transistors of the second inverter.

11. The cell of

claim 1

, wherein the complementary field effect transistors of each inverter have (a) source drain paths connected in series across a pair of DC power supply terminals, and (b) a common terminal for drains of the first and second complementary field effect transistors, the gate electrodes of the complementary transistors of the first inverter being connected to the common terminal for the drains of the second inverter, the gate electrodes of the complementary transistors of the second inverter being connected to the common terminal for the drains of the first inverter, the connections of the gate electrodes and drains of the first and second inverters being included in the regenerative feedback circuit.

12. The cell of

claim 11

further including first and second additional field effect transistors respectively having source drain paths, the first additional field effect transistor source drain path being connected between the bit line and the gate electrodes of the first and second field effect transistors of the first inverter, the second additional field effect transistor source drain path being connected between the nbit line and the gate electrodes of the first and second field effect transistors of the second inverter, each of the additional field effect transistors having a gate electrode connected to the word line, the second additional field effect transistor having a length greater than that of the first additional field effect transistor.

13. The static random access memory cell of

claim 12

wherein the first and second additional field effect transistors have approximately the same gate region widths.

14. The static random access memory cell of

claim 12

wherein the first and second additional field effect transistors have approximately the same gate region widths, equal approximately to the gate region width of each of the first and second transistors of the second inverter.

15. The cell of

claim 1

further including first and second additional field effect transistors respectively having source drain paths, the first additional field effect transistor source drain path being connected between the bit line of the gate electrodes of first and second field effect transistors of the first inverter, the second additional field effect transistor source drain path being connected between the nbit line and the gate electrodes of the first and second field effect transistors of the second inverter, each of the additional field effect transistors having a gate electrode connected to the word line.

16. The cell of

claim 15

wherein the additional field effect has a length greater than the first additional field effect transistor length.

17. The static random access memory cell of

claim 1

wherein the first and second additional field effect transistors have approximately the same gate region widths.

18. The static random access memory cell of

claim 1

wherein the first and second additional field effect transistors have approximately the same gate region widths, equal approximately to the gate region widths of the first and second transistors of the second inverter.

19. A static random access memory cell including bit and nbit lines and a word line, the cell being arranged to be read by enabling the bit line while a voltage of predetermined polarity is applied to the word line and to have a bit written in it by applying complementary voltages to the bit and nbit lines while the voltage of predetermined polarity is applied to the word line, the cell comprising first and second inverters connected to each other to form a regenerative feedback circuit, each of the inverters including first and second complementary field effect transistors, gate electrodes of the field effect transistors of the first inverter being selectively connected to the bit-line in response to the voltage of predetermined polarity being applied to the word line, gate electrodes of the field effect transistors of the second inverter being connected to the nbit line in response to the voltage of predetermined polarity being applied to the word line, the first field effect transistor of the first inverter having a drive current that is substantially larger than the drive current of the first field effect transistor of the second inverter, the first field effect transistors of the first and second inverters being of the same conductivity type.

20. The static random access memory cell of

claim 19

further including first and second additional field effect transistors respectively having source drain paths, the first additional field effect transistor source drain path being connected between the bit line and the gate electrodes of the first and second field effect transistors of the first inverter, the second additional field effect transistor source drain path being connected between the nbit line and the gate electrodes of the first and second field effect transistors of the second inverter, each of the additional field effect transistors having a gate electrode connected to the word line, the second additional field effect transistor having a length greater than that of the first additional field effect transistor.