Reactive multilayer structures for ease of processing and enhanced ductility

• US 20010046597A1
• Filed: 05/01/2001
• Published: 11/29/2001
• Est. Priority Date: 05/02/2000
• Status: Abandoned Application

• Current Assignee: Johns Hopkins University
• Original Assignee: Johns Hopkins University
• Inventors: Blobaum, Kerri J., Knio, Omar, Weihs, Timothy P., Reiss, Michael
• Application Number:
  US09/846,422
• Publication Number:
  US 20010046597A1
• Time in Patent Office: Days
• US Class Current: 428/336
• CPC Class Codes: B23K 1/0006 Exothermic brazing
• CPC Class Codes: B23K 20/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
• CPC Class Codes: B23K 20/06 by means of high energy impulses, e.g. magnetic energy
• CPC Class Codes: B23K 20/08 Explosive welding
• CPC Class Codes: B23K 20/165 involving an exothermic reaction of the interposed material
• CPC Class Codes: B23K 28/00 Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
• CPC Class Codes: B23K 35/0233 Sheets, foils B23K35/0244 takes precedence
• CPC Class Codes: B23K 35/0238 layered
• CPC Class Codes: B23K 35/34 comprising compounds which yield metals when heated
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: B32B 15/017 one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: B32B 2311/24 Aluminium
• CPC Class Codes: C04B 2235/6562 Heating rate
• CPC Class Codes: C04B 2235/6565 Cooling rate
• CPC Class Codes: C04B 2237/121 based on aluminium
• CPC Class Codes: C04B 2237/122 based on refractory metals
• CPC Class Codes: C04B 2237/123 based on iron group metals, e.g. steel
• CPC Class Codes: C04B 2237/124 based on copper
• CPC Class Codes: C04B 2237/368 Silicon nitride
• CPC Class Codes: C04B 2237/40 : Metallic
• CPC Class Codes: C04B 2237/402 : Aluminium
• CPC Class Codes: C04B 2237/60 : Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
• CPC Class Codes: C04B 2237/68 : Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
• CPC Class Codes: C04B 2237/708 : of one or more of the interlayers
• CPC Class Codes: C04B 2237/72 : Forming laminates or joined articles comprising at least two interlayers directly next to each other
• CPC Class Codes: C04B 2237/78 : Side-way connecting, e.g. connecting two plates through their sides
• CPC Class Codes: C04B 37/006 : consisting of metals or metal salts
• CPC Class Codes: C04B 37/026 : consisting of metals or metal salts
• CPC Class Codes: C06B 21/0083 : Treatment of solid structures, e.g. for coating or impregnating with a modifier compositions therefor C06B23/00
• CPC Class Codes: C06B 45/14 : a layer or zone containing an inorganic explosive or an inorganic explosive or an inorganic thermic component
• CPC Class Codes: C21D 2211/008 : Martensite
• CPC Class Codes: C23C 14/14 : Metallic material, boron or silicon
• CPC Class Codes: F24V 30/00 : Apparatus or devices using heat produced by exothermal chemical reactions other than combustion
• CPC Class Codes: H05K 2203/0405 : Solder foil, tape or wire
• CPC Class Codes: H05K 2203/1163 : Chemical reaction, e.g. heating solder by exothermic reaction oxidising metal H05K2203/0315
• CPC Class Codes: H05K 3/3463 : Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y10S 228/902 : using flame
• CPC Class Codes: Y10S 428/94 : Pressure bonding, e.g. explosive
• CPC Class Codes: Y10S 72/70 : Deforming specified alloys or uncommon metal or bimetallic work
• CPC Class Codes: Y10T 29/49925 : Inward deformation of aperture or hollow body wall
• CPC Class Codes: Y10T 29/49929 : Joined to rod
• CPC Class Codes: Y10T 428/12028 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
• CPC Class Codes: Y10T 428/12063 : Nonparticulate metal component
• CPC Class Codes: Y10T 428/12069 : Plural nonparticulate metal components
• CPC Class Codes: Y10T 428/12076 : Next to each other
• CPC Class Codes: Y10T 428/1209 : Plural particulate metal components
• CPC Class Codes: Y10T 428/12229 : Intermediate article [e.g., blank, etc.]
• CPC Class Codes: Y10T 428/12361 : having aperture or cut
• CPC Class Codes: Y10T 428/12438 : Composite
• CPC Class Codes: Y10T 428/12451 : Macroscopically anomalous interface between layers
• CPC Class Codes: Y10T 428/12493 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/1259 : Oxide
• CPC Class Codes: Y10T 428/12632 : Four or more distinct components with alternate recurrence of each type component
• CPC Class Codes: Y10T 428/1275 : Next to Group VIII or IB metal-base component
• CPC Class Codes: Y10T 428/12819 : Group VB metal-base component
• CPC Class Codes: Y10T 428/12903 : Cu-base component
• CPC Class Codes: Y10T 428/12944 : Ni-base component
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/265 : 1 mil or less
• CPC Class Codes: Y10T 428/2993 : Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]

Abstract

In accordance with the invention, a reactive multilayer structure comprises alternating layers of materials that exothermically react by a self-propagating reduction/oxidation reaction or by a self-propagating reduction/formation reaction. This combination of a reduction reaction and either an oxidation or formation reaction can lead to ductile reaction products and is frequently accompanied by the generation of large amounts of heat. As compared with conventional multilayer foils, the new multilayer structures are easier to fabricate, easier to handle, and produce more reliable bonds.

Claims

1. In a reactive multilayer structure comprising alternating layers of materials that react exothermically to produce one or more reaction products, each of the layers having a thickness in the range 1-10,000 nanometers and the multilayer structure having a total thickness in the range 10 micrometer to 1 centimeter, the improvement wherein:

the materials of respective alternating layers react by a self-propagating reduction/oxidation reaction or a self-propagating reduction/formation reaction.

2. The improved reactive structure of

claim 1

wherein one or more of the alternating layers comprises material in particle form.

3. The improved reactive structure of

claim 1

wherein each pair of alternating layers comprises a first layer including a material α

in elemental form and a second layer including a compound of the form β

Γ

_x, the layers reacting exothermically to produce reaction products of the form β and

α

Γ

_y, where α

, β

, Γ

are elements and x, y are integers or fractions, and where the initial compound, β

Γ

_x, has a lower heat of formation than the final compound, α

Γ

_y.

4. The improved reactive structure of

claim 3

where the compound is an oxide.

5. The improved reactive structure of

claim 3

where the compound is selected from the group consisting of Fe₂O₃, CuO, ZnO, and NiB.

6. The improved reactive structure of

claim 3

where the element is Al and the compound is selected from the group consisting of Fe₂O₃, CuO, and ZnO.

7. The improved reactive structure of

claim 3

where the element is a transition element and the initial compound is a boride, silicide or carbide.

8. The improved reactive structure of

claim 7

where the transition element is selected from the group consisting of Ti, Zr, and Hf and the compound is selected from the group consisting of NiB, FeB, FeSi, Cu₃Si, Ni₃C and Fe₃C.

9. The improved reactive structure of

claim 3

where the element is Pt or Pd and the initial compound is an aluminide.

10. The improved reactive structure of

claim 9

where the aluminide is CuAl₂ or TiAl₃.

11. The improved reactive structure of

claim 3

where the element is a metal.

12. The improved reactive structure of

claim 11

where the metal is Fe, Cu or Ni.

13. The process of bonding two bodies comprising the steps of:

disposing between the two bodies an improved reactive structure in accordance with

claim 1

;

pressing the bodies against the reactive structure; and

igniting the reactive structure.

14. The method of

claim 13

wherein the reactive structure produces a ductile reaction product that can serve as a solder or braze material for bonding the two bodies.

15. The method of

claim 14

wherein the ductile reaction product comprises metal.