Method of manufacturing a trench mosfet using selective growth epitaxy
First Claim
1. A method of forming a trench structure, the method comprising the steps of:
- providing a semiconductor substrate having a major surface;
forming a dielectric pillar on the substrate major surface, the dielectric pillar extending substantially perpendicularly from the major surface;
selectively forming a semiconductor layer around the dielectric pillar; and
removing a predetermined length of the dielectric pillar to create a trench in the substrate, the trench defined by sidewalls and a bottom.
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Accused Products
Abstract
A method of manufacturing a trench structure for a trench MOSFET, including the steps of providing a semiconductor substrate having a major surface, forming a dielectric pillar on the substrate major surface (the dielectric pillar extending substantially perpendicularly from the major surface of the substrate), selectively forming a semiconductor layer around the dielectric pillar, and removing a predetermined length of the dielectric pillar to create a trench in the substrate, the trench defined by sidewalls and a bottom. The method permits the controlled formation of a dielectric plug at the bottom of the trench, the plug having predetermined dimensions.
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Citations
20 Claims
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1. A method of forming a trench structure, the method comprising the steps of:
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providing a semiconductor substrate having a major surface;
forming a dielectric pillar on the substrate major surface, the dielectric pillar extending substantially perpendicularly from the major surface;
selectively forming a semiconductor layer around the dielectric pillar; and
removing a predetermined length of the dielectric pillar to create a trench in the substrate, the trench defined by sidewalls and a bottom. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a trench field effect transistor, comprising the steps of:
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providing a semiconductor substrate having a major surface and a first conductivity type;
forming a plurality of dielectric columns extending perpendicularly from the major surface of the substrate;
selectively forming a first semiconductor layer having the first conductivity type over exposed areas of the major surface of the substrate and around the dielectric columns;
selectively forming a second semiconductor layer having a second conductivity type, opposite to that of the first conductivity type, over the first semiconductor layer and around the dielectric columns;
selectively forming a third semiconductor layer having the first conductivity type over the second semiconductor layer and around the semiconductor columns;
removing a predetermined portion of each dielectric column to create a plurality of trenches extending through the third, second and a portion of the first semiconductor layer, each trench defined by a bottom and sidewalls; and
lining the sidewalls of the trenches with a gate oxide. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification