High frequency component, communication apparatus, and method for measuring characteristics of high frequency component

• US 20010050550A1
• Filed: 02/28/2001
• Published: 12/13/2001
• Est. Priority Date: 02/29/2000
• Status: Abandoned Application

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Yoshida, Norio, Watanabe, Takahiro, Ito, Tomonori
• Application Number:
  US09/795,179
• Publication Number:
  US 20010050550A1
• Time in Patent Office: Days
• US Class Current: 324/76.53
• CPC Class Codes: G01R 31/2818 using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/2824 testing of oscillators or resonators

Abstract

A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.

Claims

1. A high frequency component comprising:

a substrate;

high frequency circuit components mounted on the substrate;

a signal measuring electrode pad disposed on the substrate;

a metal cover covering the top of the substrate; and

a hole provided in the metal cover, which is disposed in the vicinity of the signal measuring electrode pad.

2. A high frequency component according to

claim 1

, wherein the diameter or width of the hole is greater than the diameter or width of the signal measuring electrode pad and are substantially equal to or less than a length corresponding to ¼

wavelength of a used frequency.

3. A high frequency component according to

claim 1

, wherein said hole is substantially round.

4. A high frequency component according to

claim 1

, wherein said hole is substantially rectangular.

5. A high frequency component according to

claim 1

, wherein said high frequency component is a PLL module.

6. A communication apparatus comprising the high frequency component according to

claim 1

.

7. A method for measuring the characteristics of a high frequency component comprising steps of:

inserting a probe in the hole of the metal cover of the high frequency component according to

claim 1

; and

measuring a voltage at the signal measuring electrode pad.

8. A method for measuring the characteristics of a high frequency component according to

claim 7

, wherein the diameter or width of the hole is greater than the diameter or width of the signal measuring electrode pad and are substantially equal to or less than a length corresponding to ¼

wavelength of a used frequency.

9. A method for measuring the characteristics of a high frequency component according to

claim 7

, wherein said hole is substantially round.

10. A method for measuring the characteristics of a high frequency component according to

claim 7

, wherein said hole is substantially rectangular.

11. A method for measuring the characteristics of a high frequency component according to

claim 7

, wherein said high frequency component is a PLL module.