Semiconductor device constituting a CMOS camera system

• US 20010050717A1
• Filed: 12/11/2000
• Published: 12/13/2001
• Est. Priority Date: 06/12/2000
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Yamada, Satoshi, Ueda, Naoto, Yasunaga, Masatoshi, Kimura, Michitaka
• Granted Patent: US 6,768,516 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The invention is intended for rendering a CMOS camera compact and less costly. A semiconductor device constituting a CMOS camera system includes a lens unit which includes a wiring board having an image pick-up opening formed therein and a lens, and the lens is provided on one side of the wiring board and positioned opposite the image pick-up opening. An image pick-up semiconductor is provided on the other side of the wiring board, and is positioned opposite the image pick-up opening, and is connected to a connection section of the wiring board by means of flip-chip bonding. An image processing semiconductor is connected by means of flip-chip bonding to another connection section provided on the other side of the wiring board, and processes an image signal output from the image pick-up semiconductor.

Claims

1. A semiconductor device constituting a CMOS camera system, comprising:

a lens unit including a wiring board having an image pick-up opening formed therein and a lens, the lens being provided on one side of the wiring board and positioned opposite the image pick-up opening;

an image pick-up semiconductor which is provided on the other side of the wiring board, positioned opposite the image pick-up opening, and is connected to a connection section of the wiring board by means of flip-chip bonding; and

an image processing semiconductor which is connected to another connection section provided on the other side of the wiring board by means of flip-chip bonding and which processes an image signal output from the image pick-up semiconductor.

2. The semiconductor device according to

claim 1

, wherein a recess is formed on the other side of the wiring board and comprises at least two steps formed so as to communicate with the image pick-up opening, one of the steps having one connection section of the wiring board, and the other step having another connection section of the wiring board;

the image pick-up semiconductor is connected to the connection section provided on the step closer to the image pick-up opening of the recess, by means of flip-chip bonding; and

the image processing semiconductor is connected to the connection section provided on the other step, by means of flip-chip bonding.

3. The semiconductor device according to

claim 1

, wherein the one connection section of the wiring board is connected to the image pick-up semiconductor by means of flip-chip bonding by way of a projecting electrode provided on either the connection section of the wiring board or the image pick-up semiconductor, and the other connection section of the wiring board is connected to the image processing semiconductor by means of flip-chip bonding by way of a projecting electrode provided on either the connection section of the wiring board or the image processing semiconductor.

4. The semiconductor device according to

claim 3

, wherein the connection section of the wiring board is flip-chip-connected to the image pick-up semiconductor by way of a projecting electrode provided on either the connection section of the wiring board or the image pick-up semiconductor while conductive particles contained in anisotropic conductive resin are sandwiched between the projecting electrode and the connection section, and the connection section of the wiring board is flip-chip-connected to the image pick-up semiconductor by way of a projecting electrode provided on either the connection section of the wiring board or the image processing semiconductor while conductive particles contained in anisotropic conductive resin are sandwiched between the projecting electrode and the connection section.

5. The semiconductor device according to

claim 1

, wherein the image pick-up semiconductor and the image processing semiconductor are not bonded together.

6. The semiconductor device according to

claim 1

, wherein the connection section of the wiring board flip-chip-connected to the image pick-up semiconductor, and the connection section of the wiring board flip-chip-connected to the image processing semiconductor are sealed with insulating sealing resin.

7. The semiconductor device according to

claim 6

, wherein a flip-chip-connected portion between the image pick-up semiconductor and the wiring board is sealed with insulating sealing resin of one type, and a flip-chip-connected portion between the image processing semiconductor and the wiring board is sealed with insulating sealing resin of another type.

8. The semiconductor device according to

claim 1

, wherein the image pick-up semiconductor and the image processing semiconductor are bonded by way of insulting resin.

9. The semiconductor device according to

claim 1

, wherein the wiring board is coupled to a motherboard by way of a flexible wiring board, and a display is provided on the motherboard for displaying an image corresponding to a signal processed by the image processing semiconductor.

10. A semiconductor device constituting a CMOS camera system, comprising:

a lens unit including a wiring board having an image pick-up opening formed therein and a lens, the lens being provided on one side of the wiring board and positioned opposite the image pick-up opening;

an image pick-up semiconductor which is provided on the other side of the wiring board, positioned opposite the image pick-up opening, and is connected to one connection section of the wiring board by means of flip-chip bonding; and

an image processing semiconductor which is connected to another connection section provided on the other side of the wiring board by means of wire bonding and which processes an image signal output from the image pick-up semiconductor.

11. The semiconductor device according to

claim 10

, wherein a recess is formed on the other side of the wiring board and comprises at least two steps formed so as to communicate with the image pick-up opening, one of the steps having one connection section of the wiring board, and the other step having another connection section of the wiring board;

the image pick-up semiconductor is connected to the one connection section provided on the step closer to the image pick-up opening of the recess, by means of flip-chip bonding; and

the image processing semiconductor is connected to the another connection section provided on the other step, by means of wire bonding.

12. The semiconductor device according to

claim 11

, wherein the recess of a stepped wiring board is sealed with insulating sealing resin, to thereby encapsulate flip-chip-bonded portions, wire-bonded portions, the image pick-up semiconductor, and the image processing semiconductor.

13. The semiconductor device according to

claim 10

, wherein the flip-chip-connected portion is sealed with insulating sealing resin of one type, and the wire-bonded portion is sealed with insulating sealing resin of another type.

14. The semiconductor device according to

claim 10

, wherein the connection section of the wiring board is flip-chip-connected to the image pick-up semiconductor by way of a projecting electrode provided on either the connection section of the wiring board or the image pick-up semiconductor while conductive particles contained in anisotropic conductive resin are sandwiched between the projecting electrode and the connection section, and a wire-bonded section is sealed with insulating sealing resin which does not contain any conductive particles.

15. The semiconductor device according to

claim 10

, wherein the wiring board is coupled to a motherboard by way of a flexible wiring board, and a display is provided on the motherboard for displaying an image corresponding to a signal processed by the image processing semiconductor.

16. A semiconductor device constituting a CMOS camera system, comprising:

a flexible wiring board having a connection section on one side;

a wiring board which is mounted on the other side of the flexible wiring board and which has an image pick-up opening and a recess formed between the image pick-up opening and the flexible wiring board so as to communicate with the image pick-up opening, and which includes a connection section provided within the recess;

a lens unit which is provided on the one side of the wiring board opposite the flexible wiring board so as to oppose the image pick-up opening;

an image pick-up semiconductor which is provided within the recess of the wiring board so as to oppose the image pick-up opening, and is connected to the connection section of the recess by means of flip-chip bonding; and

an image processing semiconductor connected to the connection section of the flexible wiring board by means of wire bonding.

17. The semiconductor device according to

claim 16

, wherein the image processing semiconductor is mounted on the surface of the wiring board opposite the surface on which the image pick-up semiconductor is mounted.

18. The semiconductor device according to

claim 16

, wherein the image processing semiconductor is mounted within the recess and on the same surface of the wiring board on which the image pick-up semiconductor is mounted. 19. The semiconductor device according to

claim 16

, wherein a flip-chip-connected portion of the image pick-up semiconductor is sealed with insulating sealing resin of one type, and a wire-bonded portion of the image processing semiconductor is sealed with insulating sealing resin of another type.