Radiation structure for heating element

• US 20010050843A1
• Filed: 08/02/2001
• Published: 12/13/2001
• Est. Priority Date: 12/07/1998
• Status: Abandoned Application

• Current Assignee: Pioneer Corporation
• Original Assignee: Pioneer Corporation
• Inventors: Ueno, Hitoshi, Yoshida, Shigeru
• Application Number:
  US09/919,834
• Publication Number:
  US 20010050843A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A heating element (IC, transistor or the like) is placed on a printed circuit board and silicon grease is coated on the surface of the printed circuit board side of the heating element. The projection portion of a radiator with a step portion is inserted into the through hole of the printed circuit board and closely contacted with the lower portion of the heating element through the silicon grease. As a result, heat generated from the heating element is transferred to the projection portion of the radiator through the silicon grease and then transferred to the entirety of the radiator. Excessive silicon grease is collected in a step portion provided at the base of the projection portion of the radiator and prevented from leaking to other portion such as a portion on the board.

Claims

1. A radiation structure for a heating element, comprising:

a base;

a projection portion provided at said base; and

a heating element placed on a through hole provided at a printed circuit board, in which said projection portion is inserted into said through hole from a surface side of said printed circuit board opposing to a surface on which said heating element is placed and contacts with said heating element through gelled cementing material, whereby heat generated by said heating element is radiated outward through said projection portion;

wherein said base includes a first surface contacting to said printed circuit board on a surface facing to said printed circuit board and at least one step surface provided at a position away from said printed circuit board than said first surface.

2. A radiation structure for a heating element according to

claim 1

, wherein said step surface is formed by said first surface contacting to said printed circuit board and a second step surface provided on a side of said first surface opposing to said projection portion.

3. A radiation structure for a heating element according to

claim 1

, wherein said step surface is formed by said first surface contacting to said printed circuit board and a third step surface provided on a projection portion side of said first surface.