Packaged integrated circuit

• US 20010052645A1
• Filed: 02/16/2001
• Published: 12/20/2001
• Est. Priority Date: 02/18/2000
• Status: Abandoned Application

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Wuyts, Ilse, Rogier, Hendrick, OpʼT Eynde, Frank Nico Lieven, Dehaeck, Willy Gerard Joseph Yolande, Terryn, Steven Gerd Alexander, Olyslager, Frank, Van Vliet, Rick, De Zutter, Daniel
• Application Number:
  US09/784,015
• Publication Number:
  US 20010052645A1
• Time in Patent Office: Days
• US Class Current: 257/700
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A Packaged Integrated Circuit, for use in a radio frequency apparatus, the Packaged Integrated Circuit comprises one or more radio frequency components that are included in an Integrated Circuit die. The Integrated Circuit die is associated with a radio frequency antenna. The radio frequency antenna is also included in the Packaged Integrated Circuit but is excluded from the Integrated Circuit die.

Claims

1. Packaged Integrated Circuit (PIC), comprising at least one radio frequency component included in an Integrated Circuit die (ICD) being associated with a radio frequency antenna (RFA), said Integrated Circuit die (ICD) being included in said Packaged Integrated Circuit (PIC)

CHARACTERISED IN THAT said radio frequency antenna is also included in said Packaged Integrated Circuit package (PIC) and is excluded from said Integrated Circuit die (ICD).

2. Packaged Integrated Circuit (PIC) according to

claim 1

,

CHARACTERISED IN THAT said Packaged Integrated Circuit (PIC) includes an Integrated Circuit Package (ICPA) which houses said at least one radio frequency component and said radio frequency antenna (RFA) which is constituted by at least one metal object that is part of said Integrated Circuit package.

3. Packaged Integrated Circuit (PIC) according to

claim 2

,

CHARACTERISED IN THAT said radio frequency antenna (RFA) is constituted by a wire bonding coupled to said Integrated Circuit die (ICD).

4. Packaged Integrated Circuit (PIC) according to

claim 2

,

CHARACTERISED IN THAT said radio frequency antenna (RFA) is applied on a metal lead frame of said Integrated Circuit package (ICPA).

5. Packaged Integrated Circuit (PIC) according to

claim 1

,

CHARACTERISED IN THAT said radio frequency antenna (RFA) consists of at least one planar metal pattern separated from a grounded metal plane by an insulating layer.

6. Packaged Integrated Circuit (PIC) according to

claim 5

,

CHARACTERISED IN THAT said planar metal pattern is a metal slot-pattern and said insulating layer is ceramic layer.

7. Packaged Integrated Circuit (PIC) according to

claim 6

,

CHARACTERISED IN THAT said slot pattern consists of a first S-shaped slot.

8. Packaged Integrated Circuit (PIC) according to

claim 7

,

CHARACTERISED IN THAT said radio frequency antenna (RFA) comprises a second S-shaped slot rotated 90 degrees with regard to said first S-shaped slot.

9. Packaged Integrated Circuit (PIC) according to

claim 1

,

CHARACTERISED IN THAT said Integrated Circuit package (ICPA) is a Ball Grid Array package.

10. Packaged Integrated Circuit (PIC) according to

claim 1

,

CHARACTERISED IN THAT said Integrated Circuit package (ICPA) is a Quad Flat Pack package.

11. Packaged Integrated Circuit (PIC) according to

claim 1

,

CHARACTERISED IN THAT said Integrated Circuit package is a Small Outline package.

12. Radio Frequency Module including at least one Packaged Integrated Circuit (PIC) according to any of the

claims 1

to

11

.