Method and apparatus for measuring a bump on a substrate

• US 20010053197A1
• Filed: 06/14/2001
• Published: 12/20/2001
• Est. Priority Date: 06/14/2000
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Murayama, Kei, Higashi, Mitsutoshi
• Granted Patent: US 6,522,719 B2
• Time in Patent Office: Days
• US Class Current: 378/58
• CPC Class Codes: G01B 15/02 for measuring thickness
• CPC Class Codes: H01L 2224/117 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys

Abstract

A method for measuring a height of a bump formed on a work of substrate, the method comprising: irradiating X-rays having a predetermined wavelength and an incident intensity toward a first work of substrate which is the same as the above-mentioned work of substrate, but no bump is formed thereon, and detecting a first X-ray transmitted intensity at a position on which the bump is to be formed; irradiating X-rays having the same wavelength and incident intensity toward a material constituting the bumps and detecting a linear absorption coefficient of the X-rays; memorizing the first X-ray transmitted intensity and the linear absorption coefficient as known data; and irradiating X-rays having the same wavelength and the same incident intensity toward a second work of substrate which is the same as the above-mentioned work of substrate, but bump is formed thereon, and detecting a second X-ray transmitted intensity at a position on which the bump is formed; and determining the height of the bump from the second X-ray transmitted intensity on the basis of the known data.

Claims

1. A method for measuring a height of a bump formed on a work of substrate, said method comprising:

irradiating X-rays, having a predetermined wavelength and an incident intensity, toward a first work of substrate which is the same as the above-mentioned work of substrate, but no bump is formed thereon, and detecting a first X-ray transmitted intensity at a position at which the bump is to be formed;

irradiating X-rays having the same wavelength and incident intensity toward a material constituting the bumps and detecting a linear absorption coefficient of the X-ray;

memorizing the first X-ray transmitted intensity and the linear absorption coefficient as known data; and

irradiating X-rays having the same wavelength and the same incident intensity toward a second work of substrate which is the same as the above-mentioned work of substrate, but a bump is formed thereon, and detecting a second X-ray transmitted intensity at a position on which the bump is formed; and

determining the height of the bump from the second X-ray transmitted intensity on the basis of the known data.

2. A method for measuring heights of first and second bumps formed on first and second surfaces, respectively, of a work of substrate in which materials of the first and second bumps are different from each other, a planar arrangement of the first bumps being the same as that of the second bumps, said method comprising:

irradiating at least two kinds of X-rays having different wavelengths toward the materials constituting the first and second bumps, respectively, and detecting first and second linear absorption coefficients of the X-rays;

memorizing the first and second linear absorption coefficients of the X-rays as known data; and

irradiating the two kinds of X-rays toward the first and second works respectively, and detecting the first and second X-ray transmitted intensities at a position on which the first and second bumps are formed; and

determining the heights of the first and second bumps from the first and second X-ray transmitted intensities on the basis of the known data.

3. An apparatus for detecting a height of bumps, said apparatus comprising:

a stage on which a work of substrate having a plurality of bumps formed thereon is disposed;

a X-ray generating unit for generating X-rays incident to the work; and

a detecting unit for detecting an intensity of X-ray transmitted through the work at a position where the bump is located.

4. An apparatus as set forth in

claim 3

, wherein the detecting unit comprises a CCD camera for detecting the intensity of X-rays transmitted through the work, and an analyzing unit for analyzing an image data output from the CCD camera to detect the intensity of X-ray transmitted through the bump.

5. An apparatus as set forth in

claim 3

, wherein the detecting unit comprises an image intensifier for detecting the intensity of X-rays transmitted through the work, and an analyzing unit for analyzing an image data output from the image intensifier to detect the intensity of X-rays transmitted through the bump.

6. An apparatus as set forth in

claim 3

, wherein the detecting unit comprises a photomultiplier tube for detecting the intensity of X-rays transmitted through the work, and an analyzing unit for analyzing an image data output from the photomultiplier tube to detect the intensity of X-rays transmitted through the bump.

7. An apparatus for detecting a height of bumps, said apparatus comprising:

a memory unit for memorizing a first X-ray transmitted intensity determined by irradiating X-rays having a predetermined wavelength and an incident intensity toward a first work of substrate which is the same as the above-mentioned work of substrate, but no bump is formed thereon, and detecting a first X-ray transmitted intensity at a position on which the bump is to be formed, and the linear absorption coefficient, as known data; and

a stage on which a work of substrate having a plurality of bumps formed thereon is disposed;

a X-ray generating unit for generating X-rays incident to the work; and

a detecting unit for detecting an intensity of X-rays transmitted through the work at a position where the bump is located and determining the height of bumps on the basis of the detected data and the known data.