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Thermosetting resin composition

  • US 20010053448A1
  • Filed: 03/19/2001
  • Published: 12/20/2001
  • Est. Priority Date: 10/06/1998
  • Status: Active Grant
First Claim
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1. A thermosetting resin composition comprising:

  • (A) a polyaddition thermosetting resin;

    (B) a silane compound represented by the formula;

    wherein R is an organic group containing a functional group which causes an addition reaction with the curing agent of said polyaddition thermosetting resin; and

    R1, R2, R3 and R4 are each a silicic group having 0 to 3 recurring units of (SiRO3/2); and

    (C) a curing agent for said polyaddition thermosetting resin.

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