Method and apparatus for edge connection between elements of an integrated circuit

• US 20010053565A1
• Filed: 06/21/2001
• Published: 12/20/2001
• Est. Priority Date: 06/19/2000
• Status: Active Grant

• Current Assignee: Theodore A. Khoury
• Original Assignee: Theodore A. Khoury
• Inventors: Khoury, Theodore A.
• Granted Patent: US 6,440,775 B2
• Time in Patent Office: Days
• US Class Current: 438/121
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01R 13/514 composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09172 Notches between edge pads
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence

Abstract

An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.

Claims

1. A method of connecting integrated circuit modules, each module having an interlocking edge adjacent to an attachment surface, and an integrated circuit element attached to the attachment surface, comprising:

connecting the interlocking edges of the integrated circuit modules, the interlocking edges being sized to be securely received by an adjacent interlocking edge so as to create a structural connection between adjacent integrated circuit modules; and

connecting the integrated circuit elements to allow the integrated circuit elements to communicate.

2. The method of connecting integrated circuit modules of

claim 1

, wherein each interlocking edge comprises a plurality of teeth and a plurality of recesses, each recess disposed between adjacent teeth and sized to securely receive a respective tooth of an adjacent interlocking edge, wherein said connecting the interlocking edges further comprises:

aligning the teeth and respective recesses of the interlocking edges; and

combining the teeth and respective recesses of the interlocking edges such that a structural connection is formed.

3. The method of connecting integrated circuit modules of

claim 1

, wherein the integrated circuit modules comprise a plurality of first and second integrated circuit modules, wherein the interlocking edge of each first integrated circuit module further comprises a ridge member, and the interlocking edge of each second integrated circuit module further comprises a recess sized to securely receive the ridge, and wherein said connecting the interlocking edges further comprises:

aligning each ridge member with a respective recess; and

combining the ridge member and the respective recess such that a structural connection is formed.

4. The method of connecting integrated circuit modules of

claim 1

, wherein said connecting comprises

determining angles between the attachment surfaces of adjacent integrated circuit modules;

connecting the interlocking edges of adjacent integrated circuit modules at the determined angle to form a structural connection.

5. The method of connecting integrated circuit modules of

claim 4

, wherein the angles are determined based upon the shape of a housing in which integrated circuit modules are housed, and/or an optimal pathway between the integrated circuit elements, wherein the optimal pathway is the most efficient combination of pathways, internal or external to the integrated circuit modules, that allows the integrated circuit elements to communicate with each other.