Method and apparatus for edge connection between elements of an integrated circuit
First Claim
1. A method of connecting integrated circuit modules, each module having an interlocking edge adjacent to an attachment surface, and an integrated circuit element attached to the attachment surface, comprising:
- connecting the interlocking edges of the integrated circuit modules, the interlocking edges being sized to be securely received by an adjacent interlocking edge so as to create a structural connection between adjacent integrated circuit modules; and
connecting the integrated circuit elements to allow the integrated circuit elements to communicate.
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Abstract
An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.
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Citations
5 Claims
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1. A method of connecting integrated circuit modules, each module having an interlocking edge adjacent to an attachment surface, and an integrated circuit element attached to the attachment surface, comprising:
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connecting the interlocking edges of the integrated circuit modules, the interlocking edges being sized to be securely received by an adjacent interlocking edge so as to create a structural connection between adjacent integrated circuit modules; and
connecting the integrated circuit elements to allow the integrated circuit elements to communicate. - View Dependent Claims (2, 3, 4, 5)
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Specification