Laser scribing of wafers
First Claim
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1. A method for dicing a semiconductor substrate comprising the steps of:
- (a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming at first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer; and
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude.
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Abstract
A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction on the substrate by scanning the laser beam across the surface of the substrate to evaporate portions of the coating layer; and forming a second set of scribe lines in a second direction on the surface of the substrate substantially orthogonal to the first set of scribe lines to evaporate portions of the layer.
33 Citations
24 Claims
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1. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to a wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming at first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer; and
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of an order of magnitude. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 22)
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17. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam having a wavelength between about 1.2 and 15 microns at a layer placed over a top surface of the substrate, the layer having a first absorption coefficient relative to the wavelength of the laser beam;
(b) absorbing energy from the laser beam into the layer based on the first absorption coefficient;
(c) forming at first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer; and
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser beam, the second direction substantially orthogonal to the first direction, wherein the substrate has a second absorption coefficient relative to the wavelength of the laser beam, the second absorption coefficient less than the first absorption coefficient by about an order of magnitude. - View Dependent Claims (18)
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19. A method for dicing a semiconductor substrate comprising the steps of:
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(a) aiming a laser beam at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser beam into only the layer;
(c) forming at first set of scribe lines in a first direction in the layer by scanning the laser beam across the layer, the laser beam removing at least a portion of the layer; and
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser beam across the layer and removing at least a portion of the layer with the laser, the second direction substantially orthogonal to the first direction, wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength from the laser beam, the first absorption coefficient greater than the second absorption coefficient. - View Dependent Claims (20)
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21. A method for dicing a semiconductor substrate using a laser and a dicing saw, the method comprising the steps of:
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(a) aiming the laser at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser into the layer;
(c) forming at first set of scribe lines in a first direction in the layer by scanning the laser across the layer, the laser removing at least a portion of the layer;
(d) forming a second set of scribe lines in a second direction in the layer by scanning the laser across the layer and removing at least a portion of the layer with the laser, the second direction substantially orthogonal to the first direction;
(e) cutting a first set of kerfs in the substrate with the dicing saw along the first set of scribe lines; and
(f) cutting a second set of kerfs in the substrate with the dicing saw along the second set of scribe lines, wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength of the laser beam, the first absorption coefficient greater than the second absorption coefficient by about an order of an order of magnitude, and the first set of kerfs and said second set of kerfs form a plurality of dice from the substrate.
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23. A method for dicing a semiconductor substrate using a laser and a dicing saw, the method comprising the steps of:
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(a) aiming the laser at a layer placed over a top surface of the substrate;
(b) absorbing energy from the laser into the layer;
(c) forming a first scribe line in a first direction in the layer by scanning the laser across the layer, the laser removing at least a portion of the layer;
(d) cutting a first kerf in the substrate with the dicing saw along the first scribe line;
(e) forming a further first scribe line in the first direction over the substrate, the further scribe line substantially parallel to the first scribe line;
(e) cutting a further first kerf in the substrate with the dicing saw along the further first scribe line;
(f) repeating steps (d) and (e) in the first direction until the entire substrate is scribed and cut;
(g) forming a second scribe line in a second direction in the layer by scanning the laser across the layer and removing at least a portion of the layer, the second direction substantially orthogonal to the first direction;
(h) cutting a second kerf in the substrate with the dicing saw along the second scribe line;
(i) forming a further second scribe line in the second direction on the substrate, the further second scribe line substantially parallel to the second scribe line;
(j) cutting a further second kerf in the substrate with the dicing saw along the further second scribe line; and
(k) repeating steps (i) and (j) in the second direction until the entire substrate is scribed and cut;
wherein the layer has a first absorption coefficient and the substrate has a second absorption coefficient relative to a wavelength of the laser beam, the first absorption coefficient greater than the second absorption coefficient by about an order of magnitude, and the first kerf, the further first kerfs, the second kerf and the further second kerfs form a plurality of dice from the substrate. - View Dependent Claims (24)
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Specification