Mobile communications device power amplifier module and mobile communications device terminal and mobile communications device base station

• US 20020002038A1
• Filed: 06/28/2001
• Published: 01/03/2002
• Est. Priority Date: 06/29/2000
• Status: Abandoned Application

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Seawright, Stephen, Nakai, Shinya
• Application Number:
  US09/892,646
• Publication Number:
  US 20020002038A1
• Time in Patent Office: Days
• US Class Current: 455/127.1
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H03B 5/1847 the active element in the amplifier being a semiconductor device
• CPC Class Codes: H03F 1/22 by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
• CPC Class Codes: H03F 1/565 using inductive elements
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 3/60 Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators H03F3/54 takes precedence
• CPC Class Codes: H03F 3/602 Combinations of several amplifiers
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

To provide a mobile communications device power amplifier module, mobile communications device terminal equipment and mobile communications device base station structured in such a manner that the mounting area of mounted parts on a mother substrate can be reduced. By the elements mounted on the multilayer substrate 56 or housed in it, the transmission voltage controlled oscillator 2B and the power amplifier 17 are structured and integrated on the same substrate.

Claims

1. A mobile communications device power amplifier module comprising:

a substrate; and

a multiplayer substrate formed on said substrate, having electronic elements which construct a transmission voltage controlled oscillator and a power amplifier,

wherein said transmission voltage controlled oscillator and said power amplifier are integrated on said substrate.

2. A mobile communications device power amplifier module according to claim 1, wherein an output impedance of said transmission voltage controlled oscillator is matched with an input impedance of said power amplifier, and said transmission voltage controlled oscillator is directly connected to said power amplifier.

3. A mobile communications device power amplifier module according to claim 1, further comprising a common shield case which covers said power amplifier and said transmission voltage controlled oscillator.

4. A mobile communications device power amplifier module according to claim 2, further comprising a common shield case which covers said power amplifier and said transmission voltage controlled oscillator.

5. A mobile communications device terminal equipment comprising:

a power amplifier module according to any one of claim 1 to claim 4.

6. A mobile communications device base station comprising:

a power amplifier module according to any one of claim 1 to claim 4.