Security module system, apparatus and process
First Claim
1. A security module for protecting circuit components from unauthorized access, the module comprising:
- a substrate composed of a plurality of layers including a first layer, the first layer of the substrate for supporting circuit components to be protected;
a cover member composed of a plurality of layers, the cover member having a surface for abutting the first layer of the substrate, the cover member defining an enclosure space for enclosing circuit components to be protected between the cover member and the substrate, when the circuit components are supported on the substrate and the cover member is abutted to the substrate; and
a sensor comprising at least one conduction path disposed in at least one of the layers below the first layer of the substrate and at least one conduction path disposed in at least one of the layers of the cover member.
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Accused Products
Abstract
A system, method and apparatus for protecting circuit components from unauthorized access. The circuit components to be protected are disposed on a first layer of a substrate with a plurality of layers. A cover member composed of a plurality of layers is abutted to the substrate, defining an enclosure space for enclosing the circuit components to be protected. A three-dimensional resistive network sensor surrounds the protected circuit components. The sensor comprises at least one conduction path in at least one of the layers below the first layer of the substrate and at least one conduction path in at least one of the layers of the cover member and also comprises a plurality of vias transverse to and electrically connecting the conduction paths. A short or open in the sensor will be detected by a tamper detection circuit that is disposed on the first layer of a substrate.
204 Citations
34 Claims
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1. A security module for protecting circuit components from unauthorized access, the module comprising:
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a substrate composed of a plurality of layers including a first layer, the first layer of the substrate for supporting circuit components to be protected;
a cover member composed of a plurality of layers, the cover member having a surface for abutting the first layer of the substrate, the cover member defining an enclosure space for enclosing circuit components to be protected between the cover member and the substrate, when the circuit components are supported on the substrate and the cover member is abutted to the substrate; and
a sensor comprising at least one conduction path disposed in at least one of the layers below the first layer of the substrate and at least one conduction path disposed in at least one of the layers of the cover member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A security module for protecting circuit components from unauthorized access, the module comprising:
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a substrate for supporting circuit components to be protected, the substrate having a first surface;
a cover member including side portions defining a second surface for abutting the first surface of the substrate, the cover member defining an enclosure space for enclosing circuit components to be protected between the cover member and the substrate and surrounded by the side portions of the cover member, when the circuit components are supported by the substrate and the second surface of the cover member is abutted to the first surface of the substrate; and
a sensor comprising a plurality of vias in the side portions of the cover member, each via comprising an electrically conductive material defining a plurality of conduction paths extending transverse to the first and second surfaces, surrounding the enclosure space, when the second surface of the cover member is abutted to the first surface of the substrate. - View Dependent Claims (13)
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14. A security module for protecting circuit components from unauthorized access, the module comprising:
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a substrate for supporting circuit components to be protected, the substrate having a first surface;
a cover member including side portions defining a second surface for abutting the first surface of the substrate, the cover member defining an enclosure space for enclosing circuit components to be protected between the cover member and the substrate and surrounded by the side portions of the cover member, when the circuit components are supported by the substrate and the second surface of the cover member is abutted to the first surface of the substrate; and
a sensor comprising a plurality of solder balls electrically connected to the second surface of the cover member, the plurality of solder balls electrically and mechanically connecting to the first surface of the substrate when the second surface of the cover member is abutted to the first surface of the substrate. - View Dependent Claims (15, 16, 17)
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18. A method for manufacturing a security module, the method comprising the steps of:
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providing a substrate, the substrate composed of a plurality of layers including a first layer, the first layer of the substrate for supporting circuit components to be protected;
providing a cover member, the cover member composed of a plurality of layers, the cover member having a surface for abutting the first layer of the substrate, the cover member defining an enclosure space for enclosing circuit components to be protected between the cover member and the substrate, when the circuit components are supported on the substrate and the cover member is abutted to the substrate;
providing a sensor comprising at least one conduction path disposed in at least one of the layers below the first layer of the substrate and at least one conduction path disposed in at least one of the layers of the cover member. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification