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Semiconductor device and method for fabricating same

  • US 20020003293A1
  • Filed: 06/29/2001
  • Published: 01/10/2002
  • Est. Priority Date: 07/04/2000
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor chip, a chip-mounting substrate which is provided with said semiconductor chip mounted on a top surface thereof and first conductive pads formed on a bottom surface thereof and connected with said semiconductor chip electrically, solder balls formed on said first conductive pads, a printed circuit board on which second conductive pads connected with said solder balls are formed, and underfill material injected into a clearance formed between said chip-mounting substrate and said printed circuit board, wherein unevenness is formed on a surface which is brought into contact with said underfill material of at least one of said chip-mounting substrate and said printed circuit board.

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