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Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof

  • US 20020004288A1
  • Filed: 04/27/2001
  • Published: 01/10/2002
  • Est. Priority Date: 04/28/2000
  • Status: Abandoned Application
First Claim
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1. A chip-like electronic component having at least its all electrodes formed on one surface thereof, a side wall thereof being covered with a protective material, and another surface opposite to said one surface fabricated to reduce its thickness.

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