Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
First Claim
1. A chip-like electronic component having at least its all electrodes formed on one surface thereof, a side wall thereof being covered with a protective material, and another surface opposite to said one surface fabricated to reduce its thickness.
1 Assignment
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Accused Products
Abstract
In order to have a thin type semiconductor chips featuring a high yield and a low cost in production, an excellent packaging reliability, and a robust structure against damages, there is provided a method of manufacturing LSI chips, comprising the steps of: pasting on a substrate an adhesive sheet which retains its adhesive strength prior to a processing, then loses it after the processing; bonding non-defective LSI chips on the adhesive sheet, with their device surfaces facing downward; uniformly coating an insulating film on the non-defective LSI chips; uniformly grinding the insulating film to a level of the bottom surfaces of these LSI chips; applying a predetermined process to the adhesive sheet to weaken its adhesive strength thereof so as to peel off a pseudo wafer on which the non-defective LSI chips are bonded; and dicing the LSI chips into a discrete non-defective electronic component by cutting the pseudo wafer.
125 Citations
20 Claims
- 1. A chip-like electronic component having at least its all electrodes formed on one surface thereof, a side wall thereof being covered with a protective material, and another surface opposite to said one surface fabricated to reduce its thickness.
- 6. A pseudo wafer comprising a plurality of a same or different types of chip-like electronic components each having at least all their electrodes formed on one surface thereof, bonded with each other with a protective material coated therebetween, and another surface opposing said one surface being fabricated to reduce a thickness thereof.
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10. A method of manufacturing chip-like electronic components comprising the steps of:
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pasting an adhesive material on a substrate, said adhesive material having a property to retain an adhesive strength prior to a processing and to lose said adhesive strength after said processing;
fixing a plurality of a same or different types of semiconductor chips on said adhesive material with an electrode surface thereof facing down;
coating a whole area including said plurality of the same or different types of semiconductor chips and a gap therebetween with a protective material;
removing said protective material from a side thereof opposite to said electrode surface to a level of a bottom surface of the semiconductor chips;
applying a predetermined process to said adhesive material to weaken said adhesive strength of said adhesive material so as to peel off a pseudo wafer on which said plurality of the same or different types of semiconductor chips are bonded; and
dicing said plurality of the same or said different types of semiconductor chips into each semiconductor chip or each chip-like electronic component by cutting said protective material in said gap therebetween. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of manufacturing a pseudo wafer comprising the steps of:
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pasting an adhesive material on a substrate, said material having a property to retain an adhesive strength prior to a processing and lose said adhesive strength after said processing;
bonding on said adhesive material a plurality of a same or different types of semiconductor chips with their electrode surfaces facing downward;
coating with a protective material a whole area of said plurality of the same or different types of semiconductor chips including a gap therebetween;
removing said protective material from a side opposite to said electrode surfaces to a level of the bottom surfaces of the semiconductor chips; and
applying a predetermined process to said adhesive material to weaken its adhesive strength so as to peel off a pseudo wafer on which said plurality of the same or different types of semiconductor chips are bonded. - View Dependent Claims (17, 18, 19, 20)
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Specification