Method and forming fine patterns of semiconductor devices using passivation layers
First Claim
1. A method for forming fine photoresist patterns on a first film, the method comprising the sequential steps of:
- a) forming a photoresist pattern on the first film using a first dry development process, the photoresist pattern comprising upper surfaces and sidewalls; and
b) forming a passivation layer on the sidewalls of the first photoresist pattern using a second dry development process incorporating a fluorine-containing gas, the passivation layer comprising hydrophobic SiOx.
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Abstract
A method is disclosed for forming fine photoresist patterns on semiconductor devices using a modified, two-step dry develop process using a fluorine-containing gas to produce hydrophobic SiOx passivation layers on the sidewalls of the photoresist patterns. These passivation layers increase the structural stability of the fine photoresist patterns and prevent moisture within an air from cohering on the photoresist patterns when the semiconductor substrate is subsequently exposed to the air, Accordingly, the present invention improves the processing margins for very high aspect ratio photoresist patterns resulting in reduced rework and increased yield on very highly integrated semiconductor devices.
4 Citations
18 Claims
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1. A method for forming fine photoresist patterns on a first film, the method comprising the sequential steps of:
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a) forming a photoresist pattern on the first film using a first dry development process, the photoresist pattern comprising upper surfaces and sidewalls; and
b) forming a passivation layer on the sidewalls of the first photoresist pattern using a second dry development process incorporating a fluorine-containing gas, the passivation layer comprising hydrophobic SiOx. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for forming fine patterns on a semiconductor device, the method comprising the steps of:
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a) forming a device layer on the semiconductor substrate;
b) forming a photoresist layer on the device layer;
c) selectively exposing surface portions of the photoresist layer to light energy, thereby forming exposed regions and unexposed regions on the surface of the photoresist layer;
d) treating the exposed surface portions of the photoresist layer to form a silylated photoresist pattern in an upper portion of the photoresist layer;
e) performing a first dry develop using the silylated photoresist pattern as a mask, thereby removing a portion of the photoresist layer beneath the unexposed regions of the photoresist layer and forming a first photoresist pattern having a silylated upper surface and substantially vertical sidewalls;
f) performing a second dry develop using a fluorine-containing gas to form hydrophobic SiOx passivation layers on the sidewalls of the first photoresist pattern sufficient to prevent moisture from cohering to the sidewalls. - View Dependent Claims (16, 17, 18)
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Specification