EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
First Claim
1. A thermosetting resin composition for carbon fiber reinforced composite materials which chiefly comprises the following component (A) and from 0.5 to 20 parts by weight of component (B) per 100 parts by weight of component (A). (A) Thermosetting resin (B) Compound having one functional group which can react with thermosetting resin (A) or its curing agent, and which contains a moiety selected from the following formulae (1) to (4)
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Abstract
In order to realize the objectives stated above, the thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises the following components.
(A) Thermosetting resin
(B) Compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4)
Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.
In accordance with the present invention, there can be obtained a thermosetting resin composition where the adhesion to reinforcing fiber by the cured material and the elastic modulus of the cured material are excellent, and by using this resin composition there can be obtained carbon fiber reinforced composite materials which are excellent in their 0° compressive strength, 90° tensile strength and interlaminar shear strength, and which also have outstanding impact resistance.
80 Citations
25 Claims
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1. A thermosetting resin composition for carbon fiber reinforced composite materials which chiefly comprises the following component (A) and from 0.5 to 20 parts by weight of component (B) per 100 parts by weight of component (A).
(A) Thermosetting resin (B) Compound having one functional group which can react with thermosetting resin (A) or its curing agent, and which contains a moiety selected from the following formulae (1) to (4)
Specification