Functional device unit and method of producing the same
First Claim
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1. A functional device unit, comprising:
- an insulating substrate having a recess formed in a surface thereof;
a wiring layer patterned on the surface of said substrate, said wiring layer continuously extending from the bottom of said recess to the top surface of said substrate via the side of said recess; and
a semiconductor device implemented in said recess of said substrate in a flip-chip manner.
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Abstract
An implementation base (10) is formed of a silicon substrate (11) having a recess (12) on a surface. Wire layers (13) are formed on the silicon substrate (11), continuously extending from the bottom of and via the side of the recess (12) to the top surface. A semiconductor chip (14) is implemented in the recess (12) of the implementation base (10) in a flip-chip manner to configure a functional device unit.
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Citations
16 Claims
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1. A functional device unit, comprising:
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an insulating substrate having a recess formed in a surface thereof;
a wiring layer patterned on the surface of said substrate, said wiring layer continuously extending from the bottom of said recess to the top surface of said substrate via the side of said recess; and
a semiconductor device implemented in said recess of said substrate in a flip-chip manner. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of producing a base for implementing a functional device, comprising the steps of:
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forming a recess in a surface of an insulating substrate;
burying an insulating layer in said recess to planarize said substrate, said insulating layer consisting of a material different from said substrate;
forming a photoresist mask on said substrate planarized with said insulating layer buried, said photoresist mask having a groove for wire-burying, said groove continuously extending from the top of said insulating layer to the outside of said recess;
etching said insulating layer to remove parts exposing through said groove of said photoresist mask;
depositing a conductive layer over said resist mask remaining on said substrate to form a wiring layer in said groove, said wiring layer continuously extending from the bottom of and via the side of said recess to the top surface of said substrate; and
removing said photoresist mask and said insulating layer successively. - View Dependent Claims (8, 9, 10)
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11. A method of producing a functional device unit, comprising the steps of:
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forming a recess in a surface of an insulating substrate;
burying an insulating layer in said recess to planarize said substrate, said insulating layer consisting of a material different from said substrate;
forming a photoresist mask on said substrate planarized with said insulating layer buried, said photoresist mask having a groove for wire-burying, said groove continuously extending from the top of said insulating layer to the outside of said recess;
etching said insulating layer to remove parts exposing through said groove of said photoresist mask;
depositing a conductive layer over said resist mask remaining on said substrate to formawiring layer in said groove, said wiring layer continuously extending from the bottom of and via the side of said recess to the top surface of said substrate;
removing said photoresist mask and said insulating layer successively; and
implementing at least one semiconductor device in said recess of said substrate in a flip-chip manner. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification