Inter-circuit encapsulated packaging

• US 20020008963A1
• Filed: 03/26/2001
• Published: 01/24/2002
• Est. Priority Date: 07/15/1999
• Status: Abandoned Application

• Current Assignee: INCEP Technologies, Inc. (KOCH Industries Incorporated)
• Original Assignee: INCEP Technologies, Inc. (KOCH Industries Incorporated)
• Inventors: Hartke, David H., DiBene, Joseph T. II
• Application Number:
  US09/818,173
• Publication Number:
  US 20020008963A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/189 Power distribution
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 4/64 Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10704 Pin grid array [PGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2018 : Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/301 : by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/1092 : with built-in components, e.g. intelligent sockets

Abstract

A modular circuit board assembly is disclosed. The modular circuit board assembly comprises a substrate, a circuit board, and a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate. In one embodiment, the circuit board also comprises an aperture allowing for the transmission of thermal energy from the component to a heat sink. In still another embodiment of the invention, the heat sink includes a mesa having surface features cooperatively interacting with surface features on the component or members mounted on the component to provide for location and/or retention.

Claims

1. A modular circuit board assembly, comprising:

a substrate;

a circuit board; and

a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate.

2. The modular circuit board assembly of claim 1, wherein the circuit board comprises an aperture disposed therethrough.

3. The modular circuit board assembly of claim 2, wherein the aperture is sized to accept a heat sink mesa therethrough.

4. The modular circuit board assembly of claim 3, wherein the mesa includes an external surface having at least one first location feature, the mesa location feature cooperatively interactable with at least one second location feature.

5. The modular circuit board assembly of claim 4, wherein the second location feature is disposed on an external surface of the component.

6. The modular circuit board assembly of claim 5, wherein the second location feature is disposed on an external surface of a member physically coupled to the component.

7. The modular circuit board assembly of claim 4, wherein the location feature is further a retention feature.

8. The modular circuit board assembly of claim 2, wherein the mesa includes an external surface having at least one first retention feature, the mesa retention feature cooperatively interactable with at least one second retention feature.

9. The modular circuit board assembly of claim 1, wherein the component is electrically coupled to the substrate via a ball grid array.

10. The modular circuit board assembly of claim 1, wherein a power signal is provided to the circuit board via a path distinct from the substrate.

11. The modular circuit board assembly of claim 1, further comprising a socket, physically coupled between the substrate and the motherboard, the socket electrically coupling the substrate and the motherboard.

12. The modular circuit board assembly of claim 1, wherein the component is mounted on a first side of the substrate, the first side of the substrate facing the circuit board.

13. The modular circuit board assembly of claim 1, wherein the first circuit board and the substrate are impermanently coupled.

14. A modular circuit board assembly, comprising:

a substrate, having a component mounted thereon, the component including a first surface; and

a circuit board, disposed adjacent the component, the circuit board having a first surface substantially co-planar with the component first surface.

15. The modular circuit board assembly of claim 14, further comprising a heat dissipation device having a substantially planar surface in thermal contact with the circuit board first surface and the component first surface.

16. A heat sink, comprising:

an external surface; and

a mesa extending from the external surface, the mesa sized to be insertable through a circuit board aperture to thermally communicate with a heat dissipating component disposed on a side of the circuit board opposing the heat sink.

17. The heat sink of claim 16, wherein the mesa further comprises at least one mesa location feature, the mesa location feature cooperatively interactable with at least one second location feature.

18. The heat sink of claim 16, wherein the second location feature is disposed on an external surface of the heat dissipating component.

19. The heat sink of claim 16, wherein the mesa location feature is further a retention feature.

20. The heat sink of claim 16, wherein the mesa further comprises at least one mesa retention feature cooperatively interactable with at least one second retention feature.

21. The heat sink of claim 20, wherein the second retention feature is disposed on an external surface of the heat dissipating component.

22. A heat sink, comprising:

an external surface; and

a depression sized to accept a component insertable through a circuit board aperture to thermally communicate with a heat dissipating component disposed on a side of the circuit board opposing the heat sink.

23. An article of manufacture, formed by performing the steps of:

mounting a first surface of the component on a substrate; and

thermally coupling a second surface of the component opposing the first surface of the component to a heat sink via an aperture in a second circuit board disposed between the heat sink and the component.

24. The article of manufacture of claim 23, wherein the second surface of the component is thermally coupled to a mesa portion of the heat sink.

25. The article of manufacture of claim 24, wherein the mesa portion includes location features.

26. The article of manufacture of claim 24, wherein the mesa portion includes retention features.