Multilayer circuit component and method for manufacturing the same

• US 20020013017A1
• Filed: 06/15/2001
• Published: 01/31/2002
• Est. Priority Date: 06/15/2000
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Iha, Michiaki
• Granted Patent: US 6,759,115 B2
• Time in Patent Office: Days
• US Class Current: 438/129
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2203/0514 Photodevelopable thick film, e.g. conductive or insulating paste
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/4667 characterized by using an inorganic intermediate insulating layer
• CPC Class Codes: H05K 3/4676 Single layer compositions
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31518 Next to glass or quartz

Abstract

A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer. The difference in the sintering properties due to the difference between the wettabilities is counterbalanced, and therefore, a multilayer circuit component, in which the warp of the substrate is reduced, and the degree of the enlargement of the via hole diameter of each of the glass-containing layers during baking is uniform, is produced.

Claims

1. A multilayer circuit component comprising a substrate, a first glass-containing layer on the substrate and a second glass-containing layer on said first glass-containing layer, wherein of the first glass-containing layer has a wettability relative to the substrate and of the second glass-containing layer has a wettability relative to the first glass-containing layer such that the baking shrinkage rates of the first and second glass-containing layers are about the same.

2. A multilayer circuit component according to claim 1, wherein a glass in the first glass-containing layer and a glass in the second glass-containing layer have softening temperatures which are different.

3. A multilayer circuit component according to claim 2, wherein the glass of said first glass-containing layer has a contact angle relative to said substrate which is larger than the contact angle of the glass of said second glass-containing layer relative to said first glass-containing layer;

and wherein the said glass of said first glass-containing layer has a softening temperature which is lower than the softening temperature of the glass of said second glass-containing layer.

4. A multilayer circuit component according to claim 2, wherein the glass of said first glass-containing layer has a contact angle relative to said substrate which is smaller than the contact angle of the glass of said second glass-containing layer relative to said first glass-containing layer;

and wherein the glass of said first glass-containing layer has a softening temperature which is higher than the softening temperature of the glass of said second glass-containing layer.

5. A multilayer circuit component according to claim 2, wherein the difference between the softening temperatures of the glass of said first glass-containing layer and the glass of said second glass-containing layer is at least about 30°

C.

6. A multilayer circuit component according to claim 2, wherein each of the first and second glass-containing layers comprise glass and ceramic, and the glass contents of the first and second glass-containing layers are different.

7. A multilayer circuit component according to claim 6, wherein the glass of said first and second glass-containing layers are low softening temperature glasses.

8. A multilayer circuit component according to claim 6, wherein the glass of the first glass-containing layer has a contact angle relative to said substrate which is larger than the contact angle of the glass of the second glass-containing layer relative to said first glass-containing layer;

and wherein the glass content of said first glass-containing layer is larger than the glass content of said second glass-containing layer.

9. A multilayer circuit component according to claim 6, wherein the glass of the first glass-containing layer has a contact angle relative to said substrate which is smaller than the contact angle of the glass constituting said second glass-containing layer relative to said first glass-containing layer;

and wherein the glass content of said first glass-containing layer is smaller than the glass content of said second glass-containing layer.

10. A multilayer circuit component according to claim 6, wherein the glass of the first glass-containing layer has a contact angle relative to said substrate which is larger than the contact angle of the glass of said second glass-containing layer relative to said first glass-containing layer;

and wherein the content of low softening temperature glass in the first glass-containing layer is larger than the content of low softening temperature glass in the second glass-containing layer.

11. A multilayer circuit component according to claim 6, wherein the glass of first glass-containing layer has a contact angle relative to said substrate which is smaller than the contact angle of the glass of said second glass-containing layer relative to said first glass-containing layer;

and the content of low softening temperature glass in the first glass-containing layer is smaller than the content of low softening temperature glass in the second glass-containing layer.

12. A multilayer circuit component according to claim 6, wherein the glasses of the each of the first and second glass-containing layers comprise at least two different glasses of which at least one is a low softening temperature glass;

and wherein the proportion of low softening temperature glass relative to total glass in said first and second glass-containing layers are different.

13. A multilayer circuit component according to claim 12, wherein the glass of said first glass-containing layer has a contact angle relative to said substrate which is larger than the contact angle of the glass of said second glass-containing layer relative to said first glass-containing layer;

and the content of glass in said first glass-containing layer is larger than the content of glass in said second glass-containing layer.

14. A multilayer circuit component according to claim 12, wherein the glass of the first glass-containing layer has a contact angle relative to said substrate which is smaller than the contact angle of the glass of the second glass-containing layer relative to said first glass-containing layer;

and the content of glass in said first glass-containing layer is smaller than the content of glass in said second glass-containing layer.

15. A method for manufacturing a multilayer circuit component which comprises at least two glass-containing layers on a substrate, in which the baking shrinkage rates of the first glass-containing layer and second glass-containing layer formed are about the same, comprising:

(a) applying and drying a first photosensitive glass paste comprising glass having a softening temperature and a photosensitive vehicle to a substrate;

(b) forming a via hole pattern on the resulting dried first paste;

(c) baking the resulting paste with said via hole pattern so as to form a first glass-containing layer;

(d) applying and drying a second photosensitive glass paste comprising glass having a softening temperature and a photosensitive vehicle, on said first glass-containing layer;

(e) forming a via hole pattern on the resulting dried second paste; and

(f) baking the resulting second paste with said via hole pattern so as to form a second glass-containing layer;

wherein at least one parameter selected from glass softening temperature and glass content in the first glass paste is different from the same parameter in the second glass paste, whereby the baking shrinkage rates of the first glass-containing layer and second glass-containing layer formed are about the same.

16. A method for manufacturing a multilayer circuit component according to claim 15, wherein the glass softening temperature parameter in the first glass paste is different from the glass softening temperature parameter in the second glass paste.

17. A method for manufacturing a multilayer circuit component according to claim 16, wherein the glasses in the pastes are such that

the glass of the first glass-containing layer has a contact angle relative to said substrate which is larger than the contact angle of the glass of the second glass-containing layer relative to said first glass-containing layer;

and

the softening temperature of the glass in the first photosensitive glass paste is lower than the softening temperature of the glass in the second photosensitive glass paste.

18. A method for manufacturing a multilayer circuit component according to claim 16, wherein the glasses in the pastes are such that

the glass of the first glass-containing layer has a contact angle relative to said substrate which is smaller than the contact angle of the glass of the second glass-containing layer relative to said first glass-containing layer;

and

the softening temperature of the glass in the first photosensitive glass paste is higher than the softening temperature of the glass in the second photosensitive glass paste.

19. A method for manufacturing a multilayer circuit component according to claim 16, wherein the difference between the softening temperature of the glass in the first photosensitive glass paste and the softening temperature of the glass in the second photosensitive glass paste is at least about 30°

C.

20. A method for manufacturing a multilayer circuit component according to claim 15, wherein the glass content in the first glass paste is different from the glass content in the second glass paste.

21. A method for manufacturing a multilayer circuit component according to claim 20, wherein the first and second photosensitive glass pastes each comprise low softening temperature glass and the low softening temperature glass content in the first and second photosensitive glass pastes are different.

22. A method for manufacturing a multilayer circuit component according to claim 21, wherein the first and second photosensitive glass pastes each comprise ceramic.

23. A method for manufacturing a multilayer circuit component according to claim 21, wherein the glass in each of the first and second photosensitive glass pastes comprise low softening temperature glass.

24. A method for manufacturing a multilayer circuit component according to claim 20, wherein the glass in the first photosensitive glass paste comprises low softening temperature glass.