Heater block having catalyst spray means

• US 20020014204A1
• Filed: 06/13/2001
• Published: 02/07/2002
• Est. Priority Date: 06/13/2000
• Status: Active Grant

• Current Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Original Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Inventors: Pyo, Sung Gyu
• Granted Patent: US 6,846,364 B2
• Time in Patent Office: Days
• US Class Current: 118/715
• CPC Class Codes: C23C 16/44 characterised by the method of coating C23C16/04 takes precedence
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45508 Radial flow

Abstract

A heater block installed within a chamber in the chemical vapor deposition (CVD) apparatus used to manufacture a semiconductor device is described. The heater block includes a catalyst spraying device comprising a support section, an upper plate coupled to an upper portion of the support section and having a projection section at an edge of the upper plate, and a heater installed at prominences and depressions of the upper plate formed of the projection section and constructed so that a wafer can be located on an upper portion of the upper plate. Catalyst is supplied through passages formed within the support section and the upper plate and is uniformly sprayed onto a surface of the wafer via a plurality of spray holes formed at the projection section.

Claims

1. A heater block having a catalyst spray means, comprising:

a support section;

an upper plate coupled to an upper portion of said support section and having a projection section at an edge of the upper plate; and

a heater installed at prominences and depressions of said upper plate and constructed so that a wafer can be located adjacent to an upper portion of said upper plate,

wherein catalyst supplied through passages formed within said support section and said upper plate is uniformly sprayed onto a surface of the wafer via a plurality of spray holes formed at said projection section.

2. The heater according to claim 1, wherein the number of said spray holes is between 16 and 128 and each of said spray holes is between 0.1 and 10 mm in diameter.

8. The heater according to claim 1, wherein said first passage is connected to a catalyst supply tube including a mass flow controller for controlling a flow amount of the catalyst.

3. A heater block having a catalyst spray means, comprising:

a support section within which a first passage is formed;

an upper plate coupled to an upper portion of said support section, and including a plurality of second passages connected said first passage, a third passage having a projection section at an edge of said upper plate and also connected to said second passages within said projection section, and a plurality of spray holes for spraying a catalyst supplied into said third passage outward from said projection section; and

a heater installed at prominences and depressions of said upper plate formed of said projection section and constructed so that a wafer can be located adjacent to an upper portion of said upper plate,

wherein the catalyst, supplied from outside through said first to third passages, is uniformly sprayed onto a surface of the wafer via said spray holes.

4. The heater according to claim 3, wherein said second passages are arranged in a radial shape.

5. The heater according to claim 3, wherein the number of said spray holes is between 4 and 32 and each of said spray holes is between 1 and 20 mm in diameter.

6. The heater according to claim 3, wherein the number of said spray holes is between 16 and 128 and each of said spray holes is between 0.1 and 10 mm in diameter.

7. The heater according to claim 3, wherein said spray holes are formed at a spray angle of 0°

to 60°

downward.