Antenna coil for IC card and manufacturing method thereof

• US 20020015002A1
• Filed: 06/21/2001
• Published: 02/07/2002
• Est. Priority Date: 06/23/2000
• Status: Active Grant

• Current Assignee: Toyo Aluminium Kabushiki Kaisha (Nippon Light Metal Holdings Co., Ltd.)
• Original Assignee: Toyo Aluminium Kabushiki Kaisha (Nippon Light Metal Holdings Co., Ltd.)
• Inventors: Kubota, Tadashi, Yoshimoto, Masami, Takano, Toshinori, Sakamoto, Hiroyuki, Tada, Hiroshi, Yasukawa, Hidenori
• Granted Patent: US 6,400,323 B2
• Time in Patent Office: Days
• US Class Current: 343/895
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

An antenna coil for an IC card includes a base material of a resin film having the thickness of at least 15 μm and at most 70 μm, and a circuit pattern layer formed on a surface of the base material, having the thickness of at least 7 μm and at most 60 μm formed of an aluminum foil containing aluminum by at least 97.5 mass % and at most 99.7 mass %. On the surface of the resin film base material, an aluminum foil containing aluminum is fixed by using a polyurethane based adhesive layer containing an epoxy resin, a resist ink layer having a prescribed pattern is printed on the foil, the foil is etched using the resist ink layer as a mask to form a circuit pattern layer, and the resist ink layer is removed.

Claims

1. An antenna coil for an IC card, comprising:

a base material containing resin and having a thickness of at least 15 μ

m and at most 70 μ

m; and

a circuit pattern layer formed on a surface of said base material, having a thickness of at least 7 μ

m and at most 60 μ

m, formed of a foil containing aluminum of at least 97.5 mass % and at most 99.7 mass %.

2. The antenna coil for an IC card according to claim 1, wherein

said foil contains iron by at least 0.7 mass % and at most 1.8 mass %.

3. The antenna coil for an IC card according to claim 1, wherein

said foil contains silicon by at least 0.03 mass % and at most 0.5 mass %.

4. The antenna coil for an IC card according to claim 1, wherein

said foil contains silicon by at least 0.03 mass % and at most 0.5 mass %, and copper by at most 0.3 mass %.

5. The antenna coil for an IC card according to claim 1, wherein

said base material includes a resin having thermal contraction coefficient of at most 0.3% when held at 150°

C. for 30 minutes.

6. The antenna coil for an IC card according to claim 1, wherein

said resin is at least one selected from the group consisting of low profile polyethylene terephthalate and low profile polyethylene naphthalate.

7. The antenna coil for an IC card according to claim 1, wherein

said circuit pattern layer includes a first circuit pattern layer formed on one surface of said base material and a second circuit pattern layer formed on the other surface of said base material.

8. The antenna coil for an IC card according to claim 7, wherein

at least a part of said first circuit pattern layer is in contact with at least a part of said second circuit pattern layer penetrating through said base material.

9. The antenna coil for an IC card according to claim 1, further comprising

an adhesive layer interposed between and bonding said circuit pattern layer and said base material.

10. The antenna coil for an IC card according to claim 9, wherein

said adhesive layer includes a polyurethane based adhesive containing an epoxy resin.

11. The antenna coil for an IC card according to claim 1, farther comprising

an underlying coating layer interposed between said circuit pattern layer and said base material and formed on a surface of said base material.

12. The antenna coil for an IC card according to claim 11, further comprising

an adhesive layer posed between and bonding said underlying coating layer and said base material.

13. The antenna coil for an IC card according to claim 12, wherein

said adhesive layer includes a polyurethane based adhesive containing an epoxy resin.

14. The antenna coil for an IC card according to claim 11, wherein

said underlying coating layer has a thickness of at least 0.1 μ

m and at most 5 μ

m.

15. The antenna coil for an IC card according to claim 11, wherein

said underlying coating layer includes at least one selected from the group consisting of epoxy based primer, acrylic primer, and vinyl chloride-vinyl acetate copolymer based primer.

17. The method of manufacturing an antenna coil for an IC card according to claim 16, wherein

said step of fixing said foil includes fixing said foil on one surface and on the other surface of said base material, and

said step of forming said circuit pattern layer includes forming a first circuit pattern layer on one surface of said base material and forming a second circuit pattern layer on the other surface of said base material.

18. The method of manufacturing an antenna coil for an IC card according to claim 17, further comprising the step of

bringing at least a part of said first circuit pattern layer into contact with at least a part of said second circuit pattern layer by a crimping process.

19. The method of manufacturing an antenna coil for an IC card according to claim 16, wherein

said step of fixing said foil on a surface of said base material includes, after forming an underlying coating layer on one surface of said foil, adhering said base material to a surface of said underlying coating layer, and

said step of printing a resist ink layer having a prescribed pattern on said foil includes printing of a resist ink layer having a prescribed pattern on the other surface of said foil.

20. The method of manufacturing an antenna coil for an IC card according to claim 16, wherein

said step of fixing said foil on a surface of said base material includes fixing said foil on a surface of said base material using a polyurethane based adhesive containing an epoxy resin.

16. A method of manufacturing an antenna coil for an IC card, comprising the steps of:

fixing, on a surface of a base material containing resin and having a thickness of at least 15 μ

m and at most 70 μ

m, a foil containing aluminum by at least 97.5 mass % and at most 99.7 mass % and having a thickness of at least 7 μ

m and at most 60 μ

m by using an adhesive;

printing a resist ink layer having a prescribed pattern on said foil;

etching said foil using said resist ink layer as a mask to form a circuit pattern layer containing aluminum; and

after etching said foil, removing said resist ink layer.