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Method and apparatus for treating low k dielectric layers to reduce diffusion

  • US 20020016085A1
  • Filed: 07/10/2001
  • Published: 02/07/2002
  • Est. Priority Date: 07/14/2000
  • Status: Active Grant
First Claim
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1. A method for processing a substrate, comprising:

  • depositing a low dielectric constant layer on the substrate in a processing chamber;

    introducing a processing gas into the processing chamber;

    generating a plasma of the processing gas in the processing chamber; and

    exposing the low dielectric constant layer to the plasma of the processing gas.

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