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Stamping foils for use in making printed circuits and radio frequency antennas

  • US 20020018880A1
  • Filed: 04/02/2001
  • Published: 02/14/2002
  • Est. Priority Date: 08/01/2000
  • Status: Abandoned Application
First Claim
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1. A stamping foil comprising:

  • a. a carrier film;

    b. a layer of heat activated adhesive;

    c. a layer of vacuum deposited copper wherein said layers are activated by heat and pressure by a die which causes said layers to delaminate from said carrier film and adhere to a surface of a substrate in a predetermined electrically conductive pattern;

    d. a substrate; and

    e. a release layer which releasably couples said layer of vacuum deposited copper to said substrate.

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