Optoelectronic surface-mountable module and optoelectronic coupling unit

• US 20020021871A1
• Filed: 07/18/2001
• Published: 02/21/2002
• Est. Priority Date: 07/18/2000
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Reill, Joachim, Hurt, Hans, Auburger, Albert, Weigert, Martin, Waidhas, Bernd, Kuhn, Gerhard, Wicke, Markus, Gattinger, Peter
• Granted Patent: US 6,550,982 B2
• Time in Patent Office: Days
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/424 Mounting of the optical light guide
• CPC Class Codes: G02B 6/4253 by embedding housing components in an adhesive or a polymer material G02B6/4212 takes precedence
• CPC Class Codes: G02B 6/4259 of the transparent type
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/181 associated with surface mounted components

Abstract

An optoelectronic surface-mountable module includes an optoelectronic component mounted on a transparent substrate. The optoelectronic component is connected to internal electrical connections which are coupled via electrical leads to external electrical connections. The external electrical connections define a light entry or exit opening. The external electrical connections are formed by a BGA, a lead frame or a plastic support with through contacts. An optical waveguide can be coupled to a circuit board of an optoelectronic coupling unit containing the module.

Claims

1. An optoelectronic surface-mountable module, comprising:

a substrate having a first side with a first main surface and a second side with a second main surface opposite said first main surface;

an optoelectronic component mounted on said first side of said substrate, said optoelectronic component utilizing a plurality of wavelengths;

said substrate being transparent to at least one of the wavelengths utilized by said optoelectronic component;

internal electrical connections provided on said first main surface and electrically connected to said optoelectronic component;

external electrical connections connected to said second main surface of said substrate;

electrical leads connecting said internal electrical connections to said external electrical connections; and

said external electrical connections defining a light passage opening opposite said optoelectronic component.

2. The optoelectronic module according to claim 1, wherein said light passage opening is an opening selected from the group consisting of a light entry opening, a light exit opening, and a light entry and exit opening.

3. The optoelectronic module according to claim 1, wherein said external electrical connections are BGA connections.

4. The optoelectronic module according to claim 1, wherein:

said external electrical connections are embodied as fusible bumps according to a BGA technology, said fusible bumps are connected to said electrical leads;

two of said bumps are spaced from one another such that an interspace is formed between said two of said bumps; and

said light passage opening is defined by said interspace between said two of said bumps.

5. The optoelectronic module according to claim 1, wherein:

said substrate has side surfaces; and

said electrical leads are U-shaped leads bent around said side surfaces and extending between said first main surface and said second main surface.

6. The optoelectronic module according to claim 1, wherein:

said external electrical connections are embodied as a lead frame having a through opening formed therein; and

said light passage opening is formed by said through opening in said lead frame.

7. The optoelectronic module according to claim 1, including:

a plastic support having a through opening formed therein;

said external electrical connections being embodied as through contacts extending through said plastic support; and

said light passage opening being formed by said through opening of said plastic support.

8. The optoelectronic module according to claim 1, wherein said substrate is a silicon substrate.

9. The optoelectronic module according to claim 1, including a lens integrated into said second main surface of said substrate.

10. An optoelectronic surface-mountable module, comprising:

a substrate having a main surface;

said main surface having a relief structure with recessed sections and elevated sections, one of said recessed sections having a bottom area;

an optoelectronic component mounted in said bottom area of said one of said recessed sections, said optoelectronic component having connections;

internal electrical connections applied on given ones of said recessed sections and being electrically connected to said connections of said optoelectronic component;

external electrical connections applied on said elevated sections; and

electrical leads connecting said internal electrical connections to said external electrical connections.

11. The optoelectronic module according to claim 10, including a transparent potting compound filled in said one of said recessed sections containing said optoelectronic component.

12. The optoelectronic module according to claim 11, including a lens integrated in said transparent potting compound.

13. An optoelectronic coupling unit, comprising:

a substrate having a first side with a first main surface and a second side with a second main surface opposite said first main surface;

an optoelectronic component mounted on said first side of said substrate, said optoelectronic component utilizing a plurality of wavelengths;

said substrate being transparent to at least one of the wavelengths utilized by said optoelectronic component;

internal electrical connections provided on said first main surface and electrically connected to said optoelectronic component;

external electrical connections connected to said second main surface of said substrate;

electrical leads connecting said internal electrical connections to said external electrical connections;

said external electrical connections defining a light passage opening opposite said optoelectronic component;

a printed circuit board electrically connected to said optoelectronic component;

said printed circuit board having a through opening formed therein, said through opening being aligned with said light passage opening; and

said printed circuit board having a side remote from said optoelectronic component and being configured to be coupled to an optical waveguide at said side remote from said optoelectronic component.

14. An optoelectronic coupling unit, comprising:

a substrate having a first side with a first main surface and a second side with a second main surface opposite said first main surface;

an optoelectronic component mounted on said first side of said substrate, said optoelectronic component utilizing a plurality of wavelengths;

said substrate being transparent to at least one of the wavelengths utilized by said optoelectronic component;

internal electrical connections provided on said first main surface and electrically connected to said optoelectronic component;

external electrical connections connected to said second main surface of said substrate;

electrical leads connecting said internal electrical connections to said external electrical connections;

said external electrical connections defining a light passage opening opposite said optoelectronic component; and

a printed circuit board electrically connected to said optoelectronic component;

said printed circuit board having a lateral entry opening formed therein, said lateral entry opening being aligned with said light passage opening; and

an optical waveguide integrated in said printed circuit board.